IMC厚度对混装焊点热疲劳寿命的影响研究  

Study on the Effect of IMC Thickness on Thermal Fatigue Life of Hybrid Solder Joints

作　　者：冉光龙 王波[1] 黄伟[1] 龚雨兵[1] 潘开林[1] RAN Guanglong;WANG Bo;HUANG Wei;GONG Yubing;PAN Kailin(Guangxi Key Lab of Manufacturing System and Advanced Manufacturing Technology,Guilin University of Electronic Technology,Guilin 541004,China)

机构地区：[1]桂林电子科技大学广西制造系统与先进制造技术重点实验室,广西桂林541004

出　　处：《电子与封装》2025年第1期18-23,共6页Electronics & Packaging

基　　金：广西高校中青年教师科研基础能力提升项目(2024KY0220);广西制造系统与先进制造技术重点实验室主任基金(23354S009)。

摘　　要：焊点的疲劳寿命成为衡量其长期可靠性的关键指标。金属间化合物(IMC)厚度对焊点的疲劳寿命有着显著影响。研究IMC厚度对热循环条件下混装焊点疲劳寿命的影响,结果表明,随着IMC厚度的增加,焊点的热疲劳寿命不断降低。此外,焊点中应力和应变的分布受IMC厚度的影响较小,但其数值随着IMC厚度的增加而增加。同时,塑性应变也随着IMC厚度的增加而增加。基于Coffin-Manson模型得到混装焊点的热疲劳寿命与IMC厚度之间存在对数关系。The fatigue life of solder joints is a key indicator of its long-term reliability.The thickness of the intermetallic compound(IMC)has a significant effect on the fatigue life of solder joints.The effect of IMC thickness on the fatigue life of hybrid solder joints under thermal cycling conditions is investigated.The results show that the thermal fatigue life of solder joints decreases continuously with the increase of IMC thickness.In addition,the distribution of stress and strain in solder joints is less affected by IMC thickness,but their values increase with the increase of IMC thickness.Meanwhile,the plastic strain increases with the increase of IMC thickness.A logarithmic relationship between the thermal fatigue life of hybrid solder joints and IMC thickness is obtained based on the Coffin-Manson model.

关 键 词：混装焊点 金属间化合物 热循环 疲劳寿命 

分 类 号：TN305.94[电子电信—物理电子学] TG405[金属学及工艺—焊接]