理论计算在PCB微盲孔电镀铜添加剂机理研究中的应用  

Application of theoretical calculation in research on mechanism of additives for microvia electroplating of PCB

作　　者：何晓峰 贾晨鑫 马汉仓 厚镛 李建丰 路旭斌 HE Xiaofeng;JIA Chenxin;MA Hancang;HOU Yong;LI Jianfeng;LU Xubin(School of Electronic and Information Engineering,Lanzhou Jiaotong University,Lanzhou 730070,China;School of Materials Science and Engineering,Lanzhou Jiaotong University,Lanzhou 730070,China)

机构地区：[1]兰州交通大学电子与信息工程学院,甘肃兰州730070 [2]兰州交通大学材料科学与工程学院,甘肃兰州730070

出　　处：《电镀与涂饰》2025年第1期81-85,共5页Electroplating & Finishing

基　　金：微盲孔电镀铜整平剂的开发与作用机理(DXS-2023-11);教育改革研究生学术沙龙建设(1600120523);玻璃通孔、盲孔中介层电镀铜溶液的开发及机理研究(DC2410732Cx0218)。

摘　　要：[目的]微孔电镀铜填充技术是实现多层印制电路板(PCB)高密度互联的关键工艺,而添加剂是实现微孔“自下而上”填充的主要因素之一。[方法]介绍了微盲孔电镀铜填充的机理模型,重点阐述了密度泛函理论(DFT)计算和分子动力学(MD)模拟在研究电镀铜添加剂作用机理中的应用。[结果]通过理论计算能够深入理解添加剂间的协同作用机制,为电镀铜添加剂的研发和筛选提供有效的策略和方法。[结论]理论计算已经成为研究材料性质和反应机理的重要手段,将其用于微盲孔电镀铜添加剂研究有助于提升PCB产品的性能和市场竞争力。[Objective]The microvia filling by electroplating copper is a key process for achieving high-density interconnection in multi-layer printed circuit board(PCB),and additives are one of the main factors to realize“bottom-to-up”filling of microvias.[Method]The mechanism models for microvia filling by electroplating copper were introduced.The application of density functional theory(DFT)calculation and molecular dynamics(MD)simulation in studying the action mechanism of electroplating copper additives was introduced.[Result]Theoretical calculations allowed for an in-depth understanding of the synergistic action among additives,providing effective strategies and methods for the development and screening of copper electroplating additives.[Conclusion]Theoretical calculations have become an important method to study material properties and reaction mechanisms,and their application in research of electroplating additives for blind microvia filling helps to enhance the performance and market competitiveness of PCB products.

关 键 词：印制电路板 微盲孔填充 电镀铜 添加剂 密度泛函理论 分子动力学模拟 综述 

分 类 号：TQ153.12[化学工程—电化学工业]