面向数字微系统应用的高密度陶瓷封装基板工艺  

Process of High-density Packaging Substrate for Digital Microsystem Application

作　　者：柴昭尔 卢会湘 徐亚新[1,3] 唐小平 李攀峰 田玉 王康 韩威[1,3] 尹学全 CHAI Zhaoer;LU Huixiang;XU Yaxin;TANG Xiaoping;LI Panfeng;TIAN Yu;WANG Kang;HAN Wei;YIN Xuequan(The 54th Research Institute of CETC,Shijiazhuang 050081,China;China Communication System Co.,Ltd.Hebei Branch.,Shijiazhuang 050081,China;National Engineering Research Center of Communication Software and Asic Design,Shijiazhuang 050081,China;Shijiazhuang Nuotong Human Resources Co.,Ltd.,Shijiazhuang 050035,China)

机构地区：[1]中国电子科技集团公司第五十四研究所,石家庄050081 [2]中华通信系统有限责任公司河北分公司,石家庄050081 [3]通信软件与专用集成电路设计国家工程研究中心,石家庄050081 [4]石家庄诺通人力资源有限公司,石家庄050035

出　　处：《电子工艺技术》2025年第1期1-3,14,共4页Electronics Process Technology

基　　金：国家自然科学基金联合基金重点支持项目(U2341223)。

摘　　要：针对数字微系统应用中对封装基板高密度集成的要求,以高密度陶瓷封装基板为研究对象,重点研究了精细线条、小间距互连孔的印刷/填孔工艺,并对其影响因素展开了详细研究,获得了最优工艺参数,为最终形成数字信号处理功能的最小系统提供了高集成陶瓷基板。For the urgent requirement of high-density packaging substrate in digital microsystem application,the high-density ceramic packaging substrate is taken as the research object,the process of fine line and fine pitch interconnect via are studied in detail.The optimized parameters are attained after thoroughly investigating the infl uence factors of the main processing.Finally,a high-reliability substrate for a minimum digital signal processing system is successfully achieved.

关 键 词：LTCC 精细线条 互连孔 

分 类 号：TN605[电子电信—电路与系统]