焊接温度对无铅回流工艺的影响  

The Impact of Soldering Temperature on Lead-free Reflow Process

作　　者：徐军军 黄文锋 解江[1] 李伟明[1] XU Junjun;HUANG Wenfeng;XIE Jiang;LI Weiming(CEPREI,Guangzhou 511370,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370

出　　处：《电子产品可靠性与环境试验》2024年第6期104-110,共7页Electronic Product Reliability and Environmental Testing

基　　金：民用飞机专项科研技术研究——质量和可靠性保证体系研究项目(MJZ2-3N21)资助。

摘　　要：研究了焊接温度对无铅回流工艺的影响,以提高电子组装领域的焊接质量和可靠性。无铅焊料因环保要求被广泛使用,但其熔点和成本较高,给焊接工艺带来挑战。通过制备测温板监控焊接温度,分析了不同工艺参数对焊接质量的影响。实验结果表明,控制峰值温度在230℃左右可以有效控制焊点的空洞率,确保焊料合金组织细腻,提高焊接质量。通过外观检查、X射线检查、金相切片、SEM&EDS分析等方法对焊接质量进行了综合评估,验证了优化后的无铅回流工艺能显著提高电子产品的高性能和长期稳定性。The effect of welding temperature on lead-free reflow process is studied to improve welding quality and reliability in electronic assembly field.Lead-free solder is widely used due to environmental requirements,but its high melting point and cost bring challenges to the welding process.The influence of different process parameters on welding quality is analyzed by preparing temperature measuring plate to monitor welding temperature.The experimental results show that controlling the peak temperature at about 230℃can effectively control the cavity rate of the solder joint,ensure the fine structure of the solder alloy,and improve the welding quality.The welding quality is evaluated by appearance inspection,X-ray examination,metallographic section and SEM&EDS analysis,and it is verified that the optimized lead-free reflux process can significantly improve the high performance and long-term stability of electronic products.

关 键 词：无铅回流工艺 焊接温度 测温板 焊接质量 空洞率 合金组织 电子组装 

分 类 号：TG44[金属学及工艺—焊接] TB114.3[理学—概率论与数理统计]