大锡面PCB回流焊后锡面发黄问题研究  

Study on the yellowing of tin surface after reflow soldering of large tin surface PCB

作　　者：张义兵 刘飞艳 麦伟 郑有能 叶星 ZHANG Yibing;LIU Feiyan;MAI Wei;ZHENG Youneng;YE Xing(Jiangmen Suntak Circuit Technology Co.,Ltd.,Guangdong Intelligent Industrial Control PCB Engineering and Technology Research and Development Center,Jiangmen 529000,Guangdong,China)

机构地区：[1]江门崇达电路技术有限公司,广东省智能工控印制电路板工程技术研究中心,广东江门529000

出　　处：《印制电路信息》2025年第2期44-48,共5页Printed Circuit Information

摘　　要：大锡面印制电路板(PCB)回流焊后,可能出现锡面发黄的现象。该问题不仅影响产品外观质量,还可能导致焊接不良,进而影响电子产品的可靠性和使用寿命。采用理论分析与实验验证相结合的方式,探究锡面发黄的根本原因,通过对助焊剂、锡条选择、锡炉内锗含量的控制,以及对回流焊参数优化等多方面的改善,成功解决锡面发黄问题,为生产工艺优化提供一定科学依据。Tin surface yellowing problem mau appear in large tin surface printed circuit board(PCB)after reflow soldering.This phenomenon not only affects the appearance of the product quality,but also may lead to poor welding,which in turn affects the reliability and service life of electronic products.In this paper,through a combination of theoretical analysis and experimental verification,the root cause of the yellowing of the tin surface is explored.Through the control of the flux,the tin bar selection,the control of germanium content in the tin furnace,the reflow soldering parameter optimization,and the improvement in other aspects,we successfully solve the problem of yellowing of the tin surface,providing certain scientificbasis tin,for the optimization of the production process.

关 键 词：印制电路板 回流焊 锡面发黄 可靠性 

分 类 号：TN41[电子电信—微电子学与固体电子学]