HDI和UHDI电路板技术的实现  

Implementation of HDI and UHDI circuit board technology

作　　者：Vern Solberg “电子首席情报官”编辑组(译) Vern Solberg;I-Connect007 Editorial Team

机构地区：[1]不详

出　　处：《印制电路信息》2025年第2期65-67,共3页Printed Circuit Information

摘　　要：探究如何实现高密度互连(HDI)和超高密度互连(UHDI)电路板技术。随着新一代高I/O半导体封装的出现,印制电路板PCB技术在制造工艺和基材选择方面经历了重大变化。详细介绍盲孔和埋孔技术在PCB设计中的应用,以及顺序积层加工流程。同时,讨论控制HDI和UHDI制造成本的策略,涵盖电路板层的组合顺序和信号传输性能的影响。最后,强调PCB制造工艺的改进和新指南标准的重要性,特别指出IPC-2226、IPC-2229和IPC-6019标准在推动高密度电路板发展中的作用。This paper explores the implementation of high-density Interconnect(HDI)and ultra-high-density interconnect(UHDI)circuit board technologies.With the advent of next-generation high I/O semiconductor packaging,printed circuit board(PCB)technology has undergone significant changes in manufacturing processes and substrate selection.The article provides a detailed introduction to the application of blind and buried via technologies in PCB design and the planning of sequential lamination processes.Additionally,methods for controlling the manufacturing costs of HDI and UHDI,including the layer combination sequence of circuit boards and the impact on signal transmission performance,are discussed.Finally,the paper highlights the importance of improvements in PCB manufacturing processes and the adoption of new guideline standards,particularly the roles of IPC-2226,IPC-2229,and IPC-6019 standards in driving the development of high-density circuit boards.

关 键 词：高密度互连 超高密度互连 顺序积层加工 

分 类 号：TN41[电子电信—微电子学与固体电子学]