PTFE板材背钻树脂塞孔盖覆电镀可靠性改善研究  

Study on reliability improvement of PTFE backdrilled resin jack cover plating

作　　者：叶霖 邹冬辉 张鸿鑫 Ye Lin;Zou Donghui;Zhang Hongxin

机构地区：[1]深圳市强达电路股份有限公司,广东深圳518000

出　　处：《印制电路资讯》2025年第1期80-83,共4页Printed Circuit Board Information

摘　　要：随着频谱的使用范围扩展到毫米波、汽车安全系统、5G通信网络以及不久将结合地面和卫星链路的6G网络等应用,对高性能、高频电路材料的需求持续增长。本文以PTFE材料生产板背钻树脂塞孔后盖覆电镀可靠性进行改善研究,希望能给业界同行提供一定的参考。As the use of spectrum expands to millimeter waves,applications such as automotive safety systems,5G communication networks,and 6G networks that will soon combine ground and satellite links,the demand for high-performance,high-frequency circuit materials continues to grow。In this paper,the reliability of plate back drilling resin plug hole back cover plating was improved by using PTFE material,hoping to provide some reference for industry peers.

关 键 词：高频电路 树脂塞孔 聚四氟乙烯 盖覆电镀 

分 类 号：TN9[电子电信—信息与通信工程]