镀通孔异物塞孔不良分析与改善  

Analysis and improvement of poor plugging of foreign matters in plated through holes

作　　者：文志美 龙春芳 熊飞燕 Wen Zhimei;Long Chunfang;Xiong Feiyan

机构地区：[1]广东依顿电子科技股份有限公司,广东中山528400

出　　处：《印制电路资讯》2025年第1期89-91,共3页Printed Circuit Board Information

摘　　要：在印制电路板(PCB)的生产过程中,孔壁质量的可靠性一直都是重点控制项目。镀通孔异物塞孔是影响孔壁质量的一种常见的缺陷,在焊接过程中,孔铜受热拉伸断裂产生开路,成为不良品,该缺陷在PCB生产过程中难以被测试中检测到,容易漏出至客户端。In the production process of printed circuit boards(PCBs),the reliability of hole wall quality has always been a key control item.Foreign matter plugging in plated through holes is a common defect that affects hole wall quality.During the welding process,the hole copper is heated and stretched and breaks to generate an open circuit,becoming a defective product.This defect is difficult to detect in the testing process during PCB production and is easily leaked to the client.

关 键 词：PCB 镀通孔 异物塞孔 

分 类 号：TN4[电子电信—微电子学与固体电子学]