电流密度对混合无氰镀银体系镀层性能的影响  

Effect of current density on properties of mixed cyanide-free silver plating system

作　　者：刘星岑 李寒松[1] 高维泽 孙境尧 孙中尧 曲军 Liu Xingcen;Li Hansong;Gao Weize;Sun Jingyao;Sun Zhongyao;Qu Jun(School of Mechanical and Electrical Engineering,Nanjing University of Aeronautics and Astronautics,Nanjing 320100,China)

机构地区：[1]南京航空航天大学机电学院,江苏南京320100

出　　处：《电镀与精饰》2025年第2期23-29,共7页Plating & Finishing

摘　　要：针对有氰镀银的危害性,采用5,5-二甲基乙内酰脲与烟酸混合的无氰镀银配方对铜基板进行镀银处理。通过调节不同的阴极电流密度,由小到大分别设置为0.1、0.5、1.0、1.5和2.0 A/dm^(2),通过性能检测并结合扫描电子显微镜(SEM)、X射线衍射(XRD)物相分析及能谱成分分析(EDS)对不同的电流密度下铜板镀银层的表面状态进行分析,并使用电化学工作站分析不同条件下镀层的性能,用来表征镀银层的耐蚀性。结果表明:当电流密度增加到1.0 A/dm^(2)时,镀层的表面状态最佳,并随着电流密度的继续增加,镀层的表面晶粒由细致的等轴晶逐渐粗化,镀银层的表面状态出现下滑的现象,但是镀层的耐蚀性能在电流密度为1.5 A/dm^(2)时达到峰值。Aiming at the harm caused by cyanide silver plating technology,a cyanide-free silver plating formula of 5,5-dimethyl hydantoin combined with niacin was developed on copper substrate.By adjusting different cathode current densities,from small to large,it was set to 0.1,0.5,1.0,1.5 and 2.0A/dm^(2),respectively.The surface state of silver-coated copper plate was analyzed through performance testing combined with scanning electron microscopy(SEM),X-ray diffraction analysis(XRD)and energy dispersive spectroscopy(EDS).And the performance of the coating under different conditions was analyzed by using an electrochemical workstation,which was used to characterize the corrosion resistance of silver plating layer.The result showed that,when the current density was increased to 1.0 A/dm^(2),the surface state of the coating was the best,and with the increase of the current density,the surface grains of the coating were coarsened gradually from fine equiaxed crystals,and the performance of the silver coating declined.However,the corrosion resistance of the coating reached its peak at 1.5 A/dm^(2).

关 键 词：无氰镀银 5 5-二甲基乙内酰脲 阴极电流密度 镀银层性能 等轴晶 

分 类 号：TQ1[化学工程]