低介电树形聚合物材料的应用进展  

Progress on Application of Low Dielectric Dendrimers

作　　者：毕研刚 滕福爱 高政纲 曾庆云 豆帆 崔淑英 徐晶 李晓珂 傅天林 豆聪 洪海哲 刘海燕 邹丽丽 周小平 Yangang Bi;Fuai Teng;Zhenggang Gao;Qingyun Zeng;Fan Dou;Sukyoung Choi;Jing Xu;Xiaoke Li;Tianlin Fu;Cong Dou;Haizhe Hong;Haiyan Liu;Lili Zou;Xiaoping Zhou(Key Laboratory for the Photoresist of Color Display and Camera Chip in Yantai,Yantai Shield Materials Technology Co.,Ltd.,Yantai 264006,China;Shandong Carrier Optoelectronic Technology Co.,Ltd.,Yantai 264006,China)

机构地区：[1]烟台希尔德材料科技有限公司烟台市彩色显示与摄像芯片光刻胶材料重点实验室,山东烟台264006 [2]山东凯瑞尔光电科技有限公司,山东烟台264006

出　　处：《高分子材料科学与工程》2024年第12期148-156,共9页Polymer Materials Science & Engineering

基　　金：烟台开发区科技领军项目(2022RC003)。

摘　　要：树形聚合物因其独特的重复性支链结构,增加了材料的自由体积,有利于降低材料的介电常数。树形聚合物支链或端基引入苯基、环烷基和杂环等低极性官能团或Si—C和C—F等低极性化学键均有利于制备低介电常数材料。低介电树形聚合物的重复性结构单元使得该类材料具有良好的溶解性、成膜性和耐温性能等。随着电子行业发展需求的不断提高,低介电树形聚合物材料表现出更广泛的应用价值。文中分五部分综述了低介电树形聚合物的研究进展:树形聚合物在光刻胶中的应用;树形聚合物在黏结剂中的应用;树形聚合物在绝缘材料中的应用;树形聚合物在耐热材料中的应用;树形聚合物在阻燃材料中的应用。Dendrimers performed potential advantages in constructing low dielectric constant(low-k)materials owing to the enhanced molecular free volume in their unique branched structure.Moreover,the chains or terminals of dendrimers could be designed as low polar functional groups such as phenyl,cycloalkyl and heterocycle or as low polar chemical bonds including Si-C and C-F.Furthermore,the low k dendrimers show good solubility,excellent film-forming property and temperature resistance due to their repetitive units.Low-k dendrimers have promising applications in high-performance electronic products.Herein,the application of low-k dendrimers was summarized as follows:photoresist,binder,insulating materials,heat-resistant materials and flame retardant materials.

关 键 词：树形聚合物 低介电常数 光刻胶 黏结剂 耐热材料 阻燃材料 

分 类 号：TQ317[化学工程—高聚物工业]