真空共晶焊接在微电子封装工艺中的应用  

Application of Vacuum Eutectic Welding in Microelectronics Packaging Process

作　　者：高瑞红 Gao Ruihong(Shanxi Railway Vocational and Technical College,Taiyuan Shanxi 030013,China)

机构地区：[1]山西铁道职业技术学院,山西太原030013

出　　处：《山西电子技术》2025年第1期29-30,105,共3页Shanxi Electronic Technology

摘　　要：以真空共晶焊接技术的工作原理为基础,介绍了真空共晶炉设备,讲解了管壳类产品封装工艺过程,分析了共晶焊接在管壳封装工艺过程中的应用。通过显微镜对共晶焊接实验前后管壳产品对比观察分析,工艺实现预期的效果,符合管壳封装工艺的实际情况。可使芯片与外部器件实现可靠的通讯,保证了传输信号的完整性。Based on the working principle of vacuum co-crystal welding technology,this article introduces the vacuum common crystal furnace equipment,explains the packaging process of tube shell products,and analyzes the application of common crystal welding in the process of tube shell packaging process.Through the comparison and analysis of the comparison of the co-crystal welding experiment before and after the co-crystal welding experiment,the expected effect of the process is achieved,and it is in line with the actual situation of the tube shell packaging process.It can enable the chip and external devices to achieve reliable communication and ensure the integrity of the transmission signal.

关 键 词：真空 共晶 封装 焊接 

分 类 号：TN305.94[电子电信—物理电子学] TN6