基于可重构环形振荡器的绑定后TSV故障测试  

A reconfigurable oscillation-based post-bond TSV test

作　　者：刘军[1] 陈志[1] 陈田[1] 程松仁 梁华国 LIU Jun;CHEN Zhi;CHEN Tian;CHENG Songren;LIANG Huaguo(School of Computer and Information,Hefei University of Technology,Hefei 230009,China;School of Microelectronics,Hefei University of Technology,Hefei 230009,China)

机构地区：[1]合肥工业大学计算机与信息学院,安徽合肥230009 [2]合肥工业大学微电子学院,安徽合肥230009

出　　处：《微电子学与计算机》2025年第2期128-134,共7页Microelectronics & Computer

基　　金：国家自然科学基金(61834006);国家重大科研仪器项目(62027815)。

摘　　要：基于硅通孔(Through Silicon Via,TSV)的三维集成电路极大提升了芯片的集成度。然而,目前TSV的工艺尚未成熟,导致TSV出现阻性开路故障、泄漏故障和桥接故障,因此需要对TSV进行测试。而现有的测试方法不能够检测TSV的各种故障且分辨各种故障类型。因此,本文提出一种基于可重构环形振荡器的绑定后TSV测试方法,能够检测和分辨TSV的各种故障。该方法能将环形振荡器可重构为非振荡、全振荡和半振荡这3种测试模式。非振荡模式用来检测桥接故障,全振荡模式检测阻性开路和泄漏故障,半振荡模式分辨阻性开路和泄漏故障的故障类型。基于PTM 45 nm工艺的HSPICE实验验证了所提方法在TSV故障检测的有效性。Three-dimensional Integrated Circuits(3D ICs)based on Through Silicon Vias(TSVs)have significantly increased chip integration.However,the current immaturity in TSV fabrication processes leads to various TSV faults like resistive open,leakage,and bridging.Hence,it's crucial to test TSVs.However,the existing test methods are not able to detect various faults of TSV and identify various fault types.Therefore,this paper presents a post-bond TSV testing method based on a reconfigurable ring oscillator capable of detecting and identifying various TSV faults.This method enables the ring oscillator to be reconfigured into three test modes:non-oscillation,all-oscillation,and half-oscillation.The nonoscillation mode detects bridging faults,all-oscillation mode checks for resistive open and leakage faults,and the halfoscillation mode distinguishes between resistive opens and leakage fault types.Experimental verification using HSPICE based on the PTM 45 nm technology validates the effectiveness of the proposed method in detecting TSV faults.

关 键 词：TSV 绑定后测试 测试模式 分辨 

分 类 号：TN407[电子电信—微电子学与固体电子学]