芯片高精度贴装方案优化研究  

Research on Optimization of High-precision Chip Mounting Solutions

作　　者：李佳 李朝毅 王达鹏 LI Jia;LI Zhao-yi;WANG Da-peng(Hebei Primemicro Technology Co.,Ltd.)

机构地区：[1]河北杰微科技有限公司

出　　处：《中国标准化》2024年第S1期309-313,共5页China Standardization

摘　　要：为了提高激光雷达系统的测量距离并减小其体积,在现有EEL激光器芯片功率的基础上,通过优化芯片贴装逻辑和制作专用工装,改善了EEL激光器芯片的贴装位置精度和角度精度,贴装位置精度由±15μm提高至±8μm,角度精度由±1°提高至±0.5°。芯片贴装位置精度的改善,提高了激光雷达的角分辨率,封装角度精度提高,降低渐晕现象对芯片出光功率的影响,进而提高激光雷达发射端的输出功率,从而满足了激光雷达的测量距离和测量精度的要求,并降低了激光雷达发射单元的组装调试难度。In order to improve the measurement distance and reduce the size of the laser radar system,on the basis of the existing EEL laser chip power,the chip mounting logic and the production of dedicated fixtures were optimized to improve the mounting position accuracy and angle accuracy of the EEL laser chip.The mounting position accuracy was improved from±15μm to±8μm,and the angle accuracy was improved from±1°to±0.5°.The improvement in chip mounting position accuracy improves the angular resolution of the laser radar,and the improvement in packaging angle accuracy reduces the impact of vignetting on the chip’s output power,thereby increasing the output power of the laser radar transmitter,meeting the requirements for measurement distance and accuracy of the laser radar,and reducing the assembly and debugging difficulties of the laser radar transmitter unit.

关 键 词：EEL芯片 贴装精度 渐晕 激光雷达 

分 类 号：TN405[电子电信—微电子学与固体电子学] TN958.98