基于FOPLP工艺多I/O芯片封装的可靠性研究及优化  

Reliability Study and Optimization of Multi-I/O Chip Packaging Based on FOPLP Process

作　　者：江京 刘建辉 陶都 宋关强 李俞虹 钟仕杰 JIANG Jing;LIU Jianhui;TAO Du;SONG Guanqiang;LI Yuhong;ZHONG Shijie(Sky Chip Interconnection Technology Co.,Ltd.,Shenzhen 518000,China)

机构地区：[1]天芯互联科技有限公司,广东深圳518000

出　　处：《电子与封装》2025年第2期6-12,共7页Electronics & Packaging

基　　金：深圳市重大科技专项(KJZD20230923114710022)。

摘　　要：随着封装工艺的进步,扇出型板级封装(FOPLP)工艺因其具有高集成度、低成本、更好的性能和更广泛的应用领域等优势而备受关注。针对基于FOPLP工艺封装的多I/O芯片产品可靠性开展了系统研究。探索和分析了产品在偏压高加速温湿度应力测试(BHAST)中的漏电问题,根据失效分析结果,将重点聚焦于爬胶高度和产品应力。同时,通过试验设计(DOE)验证了改善产品的银胶量和固定加工参数。针对多I/O芯片应力问题,采用仿真模拟优化应力分布,产品成功通过BHAST可靠性测试,满足130℃、85%RH条件下连续工作264 h的BHAST可靠性要求,对提升多I/O类产品整体性能和市场竞争力具有重要意义。With the advancement of packaging process,fan-out panel level packaging(FOPLP)process has attracted much attention due to its high integration,low cost,better performance and wider application areas.The reliability of multi-I/O chip products packaged based on FOPLP process is studied systematically.The leakage problem of products in bias high acceleration temperature and humidity stress test(BHAST)is explored and analyzed.According to the failure analysis results,the focus is placed on the climbing glue height and product stress.At the same time,the silver glue content and fixed processing parameters for improving products are verified by the design of experiment(DOE).Aiming at the stress problem of multi-I/O chip,simulation is used to optimize the stress distribution.The products successfully pass the BHAST reliability project and meet the BHAST reliability requirements of continuous operation for 264 h at 130℃and 85%RH,which is of great significance for improving the overall performance and market competitiveness of multi-I/O products.

关 键 词：扇出型板级封装 失效分析 可靠性 热应力仿真 

分 类 号：TN305.94[电子电信—物理电子学] TN406