IPM模块散热片变色研究  

Study on Exposed Thermal Pad Discoloration of IPM Module

作　　者：龚平 陈莉 顾振宇 潘效飞 GONG Ping;CHEN Li;GU Zhenyu;PAN Xiaofei(Wuxi China Resources Micro-Assembly Technology Co.,Ltd.,Wuxi 214028,China)

机构地区：[1]无锡华润安盛科技有限公司,江苏无锡214028

出　　处：《电子与封装》2025年第2期30-33,共4页Electronics & Packaging

摘　　要：智能功率模块(IPM)封装往往采用散热片外露的形式以提高其与外部环境的热交换效率。散热片通常是由具有高导热率的框架或者基板(如双面覆铜陶瓷基板)制成。由于陶瓷基板的结构特性,基板外露在塑封体外部一侧的铜层在镀锡过程中不会被锡层覆盖,因此会出现表面变色问题。对具有双面敷铜陶瓷基板的IPM模块的散热片变色现象展开分析,总结了变色的处理方法、预防措施以及各自的优缺点。研究结果表明,在封装工艺设计中,将处理与预防方法相结合,才能有效解决IPM封装中双面覆铜陶瓷基板散热片的变色问题。Intelligent power module(IPM)packages are often in the form of exposed heat sinks to improve the efficiency of heat exchange with the external environment.The heat sinks are usually made of frames or substrates with high thermal conductivity(such as double-sided direct bond copper ceramic substrates).Due to the structural characteristics of the ceramic substrates,the copper layer exposed on the outer side of the substrate of plastic package is not covered by the tin layer during tin plating process,therefore the surface discoloration problem can occur.The discoloration phenomenon of the heat sinks of IPM modules with double-sided direct bond copper ceramic substrates is analyzed,and the treatment method of discoloration,preventive measures and their respective advantages and disadvantages are summarized.The research results show that combining treatment and prevention methods in the package process design can effectively solve the discoloration problem of heat sinks of double-sided direct bond copper ceramic substrates in IPM package.

关 键 词：IPM封装 双面覆铜陶瓷基板 变色 

分 类 号：TN305.94[电子电信—物理电子学]