镀液组分对印制电路板水平化学镀锡的影响  

Effects of different components in plating bath on horizontal electroless tin plating of printed circuit board

作　　者：陈海新 邓正平 朱平 田志斌 涂颖一 CHEN Haixin;DENG Zhengping;ZHU Ping;TIAN Zhibin;TU Yingyi(Guangzhou Sanfu New Materials Technology Co.,Ltd.,Guangzhou 510663,China)

机构地区：[1]广州三孚新材料科技股份有限公司,广东广州510663

出　　处：《电镀与涂饰》2025年第2期70-74,共5页Electroplating & Finishing

基　　金：国家重点研发计划(2023YFB3408200)。

摘　　要：[目的]研究化学镀锡工艺在印刷电路板(PCB)表面处理中的应用,旨在解决传统热风整平工艺在高密度、高平整度PCB生产中的局限性。[方法]研究了镀液中主盐、配位剂、还原剂质量浓度及抗氧化剂种类对化学镀锡的影响。[结果]化学镀锡的较优配方为:Sn^(2+)20 g/L,配位剂90 g/L,还原剂80 g/L,氨基苯酚(抗氧化剂)5 g/L。[结论]采用较优配方化学镀所得Sn镀层光亮、均匀而平整,微观结构致密,焊接性能良好。[Objective]The application of electroless tin plating to the surface treatment of printed circuit board(PCB)needs to be studied to address the limitations of traditional hot air leveling process in the production of PCB with high-density and high-levelness.[Method]The effects of mass concentrations of main salt,complexing agent,and reductant in bath,as well as different antioxidants on electroless tin plating were studied.[Result]The bath composition was optimized as follows:Sn^(2+)20 g/L,complexing agent 90 g/L,reductant 80 g/L,and aminophenol as antioxidant 5 g/L.[Conclusion]The Sn coating electroplated from the optimized bath is bright,uniform,and smooth with an impact microstructure and good solderability.

关 键 词：印制线路板 化学镀锡 镀液组成 外观 热稳定性 焊接性 

分 类 号：TQ153.13[化学工程—电化学工业]