有机酸对SAC305焊锡膏焊接性能的影响  

Effect of organic acids on welding performance of SAC305 solder paste

作　　者：付翀 李振阳 李旭 肖冬 周小伟 FU Chong;LI Zhenyang;LI Xu;XIAO Dong;ZHOU Xiaowei(School of Materials Science and Engineering,Xi’an Polytechnic University,Xi’an 710048,China)

机构地区：[1]西安工程大学材料工程学院,陕西西安710048

出　　处：《西安工程大学学报》2025年第1期97-103,共7页Journal of Xi’an Polytechnic University

基　　金：西安市科技局-高校院所科技人员服务企业项目(22GXFW0031)。

摘　　要：为探究单一有机酸和有机酸复配做活性剂对SAC305焊锡膏焊接润湿性的影响,采用热失重测试确定8种有机酸的分解温度,结合焊锡膏的回流焊接实验,以焊点形貌和铺展率为指标,对单一有机酸配制的焊锡膏的焊接润湿性进行研究,筛选出3种有机酸通过均匀配方设计进行复配,并通过SEM和EDS对焊点界面层进行分析。结果表明:单一有机酸A酸、B酸和水杨酸的焊点形貌饱满、基本无回缩,铺展率在82%以上;3种有机酸复配后焊点均饱满光亮且无回缩,铺展率进一步增大;当A酸、B酸和水杨酸的质量占比分别为43.6%、28.2%、28.2%时,铺展率达到最大值为87.82%,为最佳复配含量。有机酸复配比例对金属间化合物(IMC)层厚度和形态有显著影响,IMC层厚度最小为1.67μm,最大为2.39μm。在最佳复配含量时,IMC层较为平坦、连续且均匀。In order to investigate the effect of single organic acids and organic acid compounds on the solder wettability of SAC305 solder paste,the decomposition temperature of eight organic acids was determined by the heat loss test,with the reflow soldering experiments,the solder wettability of the solder paste prepared by single organic acid was investigated by using the solder joint morphology and the spreading rate as indexes.Three organic acids were selected for compounding by the uniform formulation design,and the interfacial layer of solder joints was analyzed by SEM and EDS.The results show that single organic acid A acid,B acid and salicylic acid solder joints were in full shape,basically and spreading rate is more than 82%.Three types of organic acid compounding solder joints were full of bright and no retraction,and the spreading rate further increased.when the mass ratio of A acid,B acid and salicylic acid was 43.6%,28.2%and 28.2%,the spreading rate reached a maximum of 87.82%,and it was the best compounding content.The analysis of the interfacial layer of solder joints showed that the compounding ratio of organic acids had a significant effect on the thickness and morphology of the intermetallic compound(IMC)layer,and the thickness of the IMC layer was 1.67μm at the minimum and 2.39μm at the maximum.The IMC layer was relatively flat,continuous and homogeneous at the optimum compounding content.

关 键 词：SAC305焊锡膏 有机酸 铺展率 焊点形貌 金属间化合物(IMC) 

分 类 号：TG425.1[金属学及工艺—焊接]