系统封装高速链路中跨层信号通路与配电网络协同分析  

Co⁃analysis of Cross⁃layer Signal Path and Power Distribution Network in High⁃speed Link of System⁃in⁃package

作　　者：李涛[1,2,3] 缪旻[1,2,3] LI Tao;MIAO Min(Key Laboratory of Information and Communication Systems,Ministry of Information Industry,Beijing Information Science and Technology University,Beijing,100101,CHN;Key Laboratory of the Ministry of Education for Optoelectronic Measurement Technology and Instrument,Beijing Information Science and Technology University,Beijing,100192,CHN;Academy of Smart IC and Network(ASICNet),Beijing Information Science and Technology University,Beijing,100101,CHN)

机构地区：[1]北京信息科技大学信息与通信系统信息产业部重点实验室,北京100101 [2]北京信息科技大学光电测试技术及仪器教育部重点实验室,北京100192 [3]北京信息科技大学智能芯片与网络研究中心,北京100101

出　　处：《固体电子学研究与进展》2025年第1期59-66,共8页Research & Progress of SSE

基　　金：国家自然科学基金联合基金“叶企孙”科学基金项目(U2341223);国家自然科学基金面上项目(62074017)。

摘　　要：针对高速链路信号通路中典型的垂直过孔互连结构和配电网络电源/地平面对的信号完整性(Signal integrity, SI)与电源完整性(Power integrity, PI)问题进行了研究,分析了其电磁耦合机理,提出了一种流程相对简单、资源开销小、建模效率高的协同分析方法。以在研的某型复合陶瓷SiP样品中信号通路和配电网络结构的设计为例,对所提出的协同分析方法的有效性进行了验证。In this paper,the signal integrity(SI)and power integrity(PI)problems for a typical vertical via interconnect structure in the signal path of a high-speed link in combination with surround-ing power/ground plane pairs for power distribution network,were studied,and the mechanism of electromagnetic coupling was revealed.Thereupon,a co-analysis method with relatively succinct flow,low resource consumption and high modeling efficiency is proposed.Taking the design of signal path and power distribution network structure of a composite ceramic SiP sample as an example,the proposed co-analysis method and its effectiveness are studied and demonstrated.

关 键 词：协同分析 信号完整性 电源完整性 高速链路 系统封装 

分 类 号：TN702[电子电信—电路与系统]