聚氨酯基复合弹性体阳极键合阴极材料的性能  

Performance of Polyurethane-based Composite Elastomer Cathodic Material for Anodic Bonding

作　　者：赵浩成 姚志广 尤雪瑞 赵丽芝 ZHAO Haocheng;YAO Zhiguang;YOU Xuerui;ZHAO Lizhi(Faculty of Energy Chemistry and Materials Engineering,Shanxi Institute of Energy,Jinzhong 030600,China;Faculty of Mechanical and Electrical Engineering,Shanxi Institute of Energy,Jinzhong 030600,China)

机构地区：[1]山西能源学院能源化学与材料工程系,晋中030600 [2]山西能源学院机电工程系,晋中030600

出　　处：《材料研究学报》2025年第1期63-70,共8页Chinese Journal of Materials Research

基　　金：国家自然科学基金(22306116);山西省基础研究计划(202203021211284)。

摘　　要：在室温浇注成型制备出三种聚氨酯基复合弹性体阳极键合阴极材料(CPUEEs)。聚氨酯微相呈分离形态,CPUEEs的T_(d,5%)都高于200℃,其热稳定性可满足阳极键合要求。CPUEEs具有无定形结构,T_(g)都低于-45℃,其分子链段具有良好的低温柔顺性,可为阳极键合锂离子迁移提供必要的通道。所有的CPUEEs样品在键合温度的离子导电率都符合键合的要求。PPC和SN共混改性的CPUEE3离子导电率最大,可达6.5×10^(-4) S·cm^(-1)。进行热引导动态场阳极键合可实现CPUEEs和铝箔(Al)的阳极键合连接,CPUEEs-Al键合界面键合层的键合强度为1.15 MPa。The application of anodic bonding,as an important technology in the semiconductor industry,in the field of flexible electronics encapsulation will be beneficial to the further popularization of the commercialization of flexible devices.The key solution is the preparation of high-performance polymer flexible substrates suitable for anodic bonding.Herein,three kinds of polyurethane-based composite elastomer cathodic materials(CPUEEs)for anodic bonding are prepared by room temperature casting,of which the microphase separation morphology can be observed by SEM.Results show that the CPUEEs present T_(d,5%) above 200℃ with thermal stability meets the requirements of anodic bonding,besides,the CPUEEs present amorphous structure with T_(g) lower than -45℃,and their molecular segments have good low temperature flexibility,which can provide the necessary space for lithium ion migration during anodic bonding.The ionic conductivity of all samples at the bonding temperature meets the bonding requirements,and the ionic conductivity value of CPUEE3 modified by blending with PPC and SN is the highest up to 6.5×10^(-4)S·cm^(-1).The anodic bonding of CPUEEs and aluminum foil(Al)may be realized by heat-guided dynamic field anodic bonding technique.The bonding interface of CPUEEs-Al can be clearly observed in the SEM image,and the bonding strength of CPUEE3-Al can reach up to 1.15 MPa.

关 键 词：有机高分子材料 阳极键合 聚氨酯 离子导电率 柔性器件 封装 

分 类 号：TB34[一般工业技术—材料科学与工程]