基于声学显微C扫描检测技术的倒装集成电路失效分析  

Failure analysis of flip integrated circuits based on acoustic microscopy C-scan detection technology

作　　者：李登科[1] 王高凯 LI Dengke;WANG Gaokai(China Airborne Missile Academy,Luoyang 471009,China)

机构地区：[1]中国空空导弹研究院,洛阳471009

出　　处：《无损检测》2025年第2期1-6,共6页Nondestructive Testing

摘　　要：随着倒装集成电路在电子产品中的广泛应用及其失效问题的日益凸显,对其失效分析技术的要求越来越高。研究了声学显微镜C扫描模式下换能器频率、放大器增益和倒装集成电路芯片厚度间的关系,发现声学扫描图像清晰度随着换能器频率的增加而提升;相同频率下,芯片厚度增加时,需提高放大器的增益来保证成像质量。此外还研究了声学显微C扫描检测技术在倒装集成电路失效分析中的应用场景,结果表明该技术可以无损检测出倒装集成电路内部的空洞、分层及裂纹等缺陷,完成对失效机理的准确判断。With the widespread application of flip-chip integrated circuits in electronic products and the increasingly prominent issue of their failures,the requirements for their failure analysis technology have become increasingly demanding.The relationship among the transducer frequency,amplifier gain,and integrated circuits flip-chip thickness in C-scan mode of the acoustic microscope was explored.It was found that the clarity of ultrasonic scanning images was effectively improved with the increase in transducer frequency;at the same frequency,as the chip thickness increased,the gain of the amplifier was needed to be increased to ensure imaging quality.Furthermore,the application scenarios of acoustic microscopic C-scan detection technology in the failure analysis of flip-chip integrated circuits were investigated.The results indicated that this technology can nondestructively detect defects such as voids,delamination,and cracks inside flip-chip devices,enabling accurate judgment of failure mechanisms.

关 键 词：声学扫描显微镜 倒装芯片 失效分析 分层 芯片裂纹 

分 类 号：TN407[电子电信—微电子学与固体电子学] TG115.28[金属学及工艺—物理冶金]