晶上系统广义功能安全技术研究综述  

Survey on generalized safety and security technology for system on wafer

作　　者：李沛杰 郭威[1] 沈剑良[1] 曹志鹏 梅波 LI Peijie;GUO Wei;SHEN Jianiang;CAO Zhipeng;MEI Bo(Information Engineering University,Zhengzhou 450001,China)

机构地区：[1]信息工程大学,河南郑州450001

出　　处：《网络与信息安全学报》2025年第1期1-19,共19页Chinese Journal of Network and Information Security

基　　金：国家重点研发计划(2022YFB4401401,2023YFB4404202)。

摘　　要：随着集成电路摩尔定律的逐步失效,未来信息系统的技术物理形态将由集成芯片向集成系统发展,晶上系统作为集成系统的一种,相比2D/2.5D/3D集成芯片,既有传统SoC芯片的逻辑结构和2.5D/3D异构集成电路工艺集成的微系统结构,也有面向系统应用的软硬件协同结构,呈现出功能安全、信息安全和网络安全融合交织的系统级广义功能安全问题,现有2D/2.5D/3D IC芯片级的安全技术已难以满足。首先分析了2D/2.5D/3D IC的安全问题及从芯片上升到系统后现有芯片级安全技术的不足,然后阐述了晶上系统广义功能安全问题产生的过程、面临的新挑战和新机遇。首次将晶上系统与网络空间内生安全理论结合,提出一种晶上系统的广义功能安全威胁模型,给出晶上系统广义功能安全技术的3个发展趋势。With the failure of Moore's law in integrated circuits,the technical and physical form of information sys‐tems was expected to evolve from integrated chip(IC)to integrated system(IS).Compared to 2D/2.5D/3D IC,sys‐tem on wafer(SoW),as one of the IS,was characterized by both the logic structures of system on chip(SoC)and the microsystem structures for 2.5D/3D heterogeneous IC,as well as the macrosystem structures for complex applica‐tions.The existing 2D/2.5D/3D IC chip-level security technologies were found to be insufficient in addressing the proposed generalized safety and security(GSS)problems,which included functional safety,information security,and cyberspace security.Firstly,the security problems of 2D/2.5D/3D IC were analyzed,and the shortcomings of the existing security technologies were identified with the transition from IC to IS.Then,the causes of GSS problems and the associated challenges were analyzed.A GSS threat model for SoW was proposed for the first time by integrating the SoW with the cyberspace endogenous safety and security theory.Additionally,the research progress of GSS tech‐nology was summarized.Finally,three development trends of GSS technology for SoW were outlined.

关 键 词：硬件木马 广义功能安全 动态异构冗余 晶上系统 异构集成 

分 类 号：TP309.2[自动化与计算机技术—计算机系统结构]