晶圆加工腔室自清洗模块的系统设计  

System Design of Self Cleaning Module for Wafer Processing Chamber

作　　者：郭燕涛 曾聪 熊文清 GUO Yantao;ZENG Cong;XIONG Wenqing(School of Mechanical Engineering,Jiangxi University of Science and Technology,Ganzhou,Jiangxi 341000,China)

机构地区：[1]江西理工大学机电工程学院,江西赣州341000

出　　处：《自动化应用》2025年第5期190-193,共4页Automation Application

基　　金：江西理工大学高层次人才科研专项基金(205200100648)。

摘　　要：随着半导体制造工艺的进步,对晶圆制造环境的要求更为严苛。晶圆腔室中残余的污染会干扰后续加工,导致晶圆表面的加工质量下降,因此清洁晶圆加工腔室至关重要。基于腔室清洗设计了晶圆加工腔室自清洗模块的三维模型,并利用有限元分析软件对结构强度进行了验证。通过不同进气角度和高度下的气体流场仿真实验,验证了自清洗模块在不同条件下的清洗效果,为实际应用奠定了坚实的基础。With the advancement of semiconductor manufacturing technology,the requirements for wafer manufacturing environment are becoming more stringent.The residual contamination in the wafer chamber can interfere with subsequent processing,leading to a decrease in the processing quality of the wafer surface.Therefore,cleaning the wafer processing chamber is crucial.A three-dimensional model of a self-cleaning module for wafer processing chambers was designed based on chamber cleaning,and the structural strength was verified using finite element analysis software.Through simulation experiments of gas flow fields at different intake angles and heights,the cleaning effect of the self-cleaning module under different conditions was verified,laying a solid foundation for practical applications.

关 键 词：半导体制造 晶圆加工 腔室清洗 静力学分析 气流场分析 

分 类 号：TP273[自动化与计算机技术—检测技术与自动化装置]