漫话半导体先进封装技术中的新网版印刷(八)  

New Screen Printing in Advanced Packaging Technology for Semiconductors(Part 8)

作　　者：熊祥玉 巢亚平 陈港能 李蓉 XIONG Xiangyu;CHAO Yaping;CHEN Gangneng;LI Rong

机构地区：[1]不详

出　　处：《丝网印刷》2025年第3期18-22,共5页Screen Printing

摘　　要：随着我国新能源汽车、工业控制、轨道交通、新能源风电等领域的飞速发展,关键元器件IGBT在高压、大电流和高速等方面具有其他功率器件无法比拟的优势。为了减小金属化电极的热机械应力,集电极通常采用网版印刷技术制备的多层金属化电极。With the rapid development of China's new energy vehicles,industrial control,rail transit,new energy wind power and other fi elds,the key component IGBT has incomparable advantages in high voltage,high current and high speed.In order to reduce the thermal mechanical stress of the metallized electrode,the collector is usually made of multilayer metallized electrode prepared by screen printing technology.

关 键 词：IGBT 网版印刷技术 金属化电极 

分 类 号：TN3[电子电信—物理电子学]