PEG在电子电镀铜中的作用机制及应用  

The mechanism and application of PEG in electronic electroplating of copper

作　　者：杨彦章 陈志华 钟上彪 叶绍明 刘彬云 詹东平[4] Yang Yanzhang;Chen Zhihua;Zhong Shangbiao;Ye Shaoming;Liu Binyun;Zhan Dongping(Guangdong Guanghua Sci-Tech Co.,Ltd.,Shantou 515061,China;Guanghua Science and Technology Research Institute(Guangdong)Co.,Ltd.,Guangzhou 511400,China;Guangdong Dongshuo Technology Co.,Ltd.,Guangzhou 510288,China;College of Chemistry and Chemical Engineering,Xiamen University,Xiamen 361005,China)

机构地区：[1]广东光华科技股份有限公司,广东汕头515061 [2]光华科学技术研究院(广东)有限公司,广东广州511400 [3]广东东硕科技有限公司,广东广州510288 [4]厦门大学化学化工学院,福建厦门361005

出　　处：《电镀与精饰》2025年第3期96-105,共10页Plating & Finishing

基　　金：广东省重点领域研发计划(项目编号2023B0101040002)。

摘　　要：电镀铜是电子工业中不可或缺的工艺,广泛应用于印刷电路板、集成电路等电子元件的线路互联制造,铜镀层质量对产品性能和可靠性至关重要。聚乙二醇(PEG)是电镀铜工艺的重要添加剂之一,能改善镀层质量和性能,显著提升电镀产品应用可靠性。本文综述PEG在电镀铜中的作用机制,包括对铜离子还原、镀液性质和铜晶粒生长的影响,以及对铜镀层性能的多方面改善效应。同时,对比不同类型PEG衍生物和类似物的应用效果,并对未来研究方向进行了展望。Copper electroplating is an indispensable process in the electronics industry,widely used in the manufacture of interconnections for printed circuit boards,integrated circuits and other electronic components.The quality of the electroplated copper layer is crucial to product performance and reliability.Polyethylene glycol(PEG)is one of the key additives in copper electroplating processes,which can improve the quality and performance of the coating,significantly enhancing the application reliability of electroplated products.This paper reviews the mechanism of PEG in copper electroplating,including its effects on copper ion reduction,electrolyte properties,and copper grain growth,as well as its multi-faceted improvement effects on coating performance.Furthermore,the applications of different PEG derivatives and analogues are compared,and future research directions are prospected.

关 键 词：PEG(聚乙二醇) 电镀铜 作用机制 电镀性能 

分 类 号：TG172[金属学及工艺—金属表面处理]