基于双组份微胶囊自修复的环氧树脂自愈与闪络特性  

Self-healing and Flashover Properties of Epoxy Resin Based on Two-component Microcapsule Self-healing

作　　者：王健[1] 陈科达 侯程志 晁文豪 李庆民[1] WANG Jian;CHEN Keda;HOU Chengzhi;CHAO Wenhao;LI Qingmin(School of Electrical and Electronic Engineering,North China Electric Power University,Beijing 102206,China)

机构地区：[1]华北电力大学电气与电子工程学院,北京102206

出　　处：《高电压技术》2025年第2期915-924,共10页High Voltage Engineering

基　　金：国家自然科学基金(52177140,92266109);中央高校基本科研业务费专项资金(2023JC005);山东省重点研发计划(2022JMRH0303)。

摘　　要：材料质量、加工工艺和外力作用等原因会使环氧树脂形成微裂纹,降低其绝缘性能。针对单组分微胶囊的误修复问题,设计了一种基于双组分微胶囊自修复的环氧树脂复合介质。实验结果表明,复合介质的愈合率随着微胶囊含量的增加而增加,当微胶囊质量分数为10%时,愈合率达到85%左右。此外,固化温度和工作温度会增强修复剂流动性和加快固化反应速率,从而提高修复速度。绝缘性能试验表明,随着微胶囊含量的增加,复合介质的介电损耗增大,击穿电压降低,但闪络电压先增大后减小。介电损耗增加的主要原因是微胶囊的加入增加了界面极化损耗和取向极化损耗;击穿电压下降的原因主要是微胶囊的加入引入了界面缺陷以及微胶囊较高的电导率。当微胶囊含量较低时,陷阱缺陷密度增大,导致闪络电压先增大;当微胶囊含量高时,液芯材料增加,复合介质的表面电导率增加,导致闪络电压降低。划痕损伤修复后,介质表面的闪络电压可恢复到未修复时的105%~116%左右。The material quality,processing technology and external force will cause the epoxy resin to form micro-cracks and reduce its insulation performance.To solve the problem of misrepair of one-component microcapsules,an epoxy resin composite medium based on two-component microcapsules was designed in this paper.The experimental results show that the healing rate of composite media increases with the increase of microcapsule content,and when the microcapsule mass fraction is 10%,the healing rate reaches about 85%.In addition,the curing temperature and working temperature will enhance the fluidity of the repair agent and accelerate the curing reaction rate,thus improving the repair speed.The insulation performance test shows that,with the increase of microcapsule content,the dielectric loss of the composite me-dium increases,the breakdown voltage decreases,but the flashover voltage increases first and then decreases.The main reason for the increase of dielectric loss is that the addition of microcapsules increases the interface polarization loss and orientation polarization loss.The main reasons for the decrease of breakdown voltage are the interface defects introduced by the addition of microcapsules and the high conductivity of microcapsules.When the microcapsule content is low,the trap defect density increases,thus the flashover voltage increasing first.When the microcapsule content is high,the liquid core material increases,the surface conductivity of the composite medium increases,and the flashover voltage decreases.After the scratch damage is repaired,the flashover voltage on the surface of the medium can be restored to about 105%-116%of that without repair.

关 键 词：微胶囊 双组份 环氧树脂 自愈 闪络电压 

分 类 号：TM215.1[一般工业技术—材料科学与工程]