国产化LTCC基陶瓷管壳的可靠性分析  

Reliability Analysis of Localization LTCC Ceramic Package

作　　者：卢会湘 柴昭尔[2,3] 徐亚新 唐小平[1,2,3] 李攀峰 田玉 王康[2,3] 韩威 尹学全 LU Huixiang;CHAI Zhaoer;XU Yaxin;TANG Xiaoping;LI Panfeng;TIAN Yu;WANG Kang;HAN Wei;YIN Xuequan(China Communication System Co.,Ltd.Hebei Branch.,Shijiazhuang 050081,China;The 54th Research Institute of CETC,Shijiazhuang 050081,China;National Engineering Research Center of Communication Software and Asic Design,Shijiazhuang 050081,China;Shijiazhuang Nuotong Human Resources Co.,Ltd.,Shijiazhuang 050035,China)

机构地区：[1]中华通信系统有限责任公司河北分公司,石家庄050081 [2]中国电子科技集团公司第五十四研究所,石家庄050081 [3]通信软件与专用集成电路设计国家工程研究中心,石家庄050081 [4]石家庄诺通人力资源有限公司,石家庄050035

出　　处：《电子工艺技术》2025年第2期11-14,共4页Electronics Process Technology

基　　金：国家自然科学基金联合基金重点支持项目(U2341223)。

摘　　要：针对低温共烧陶瓷(LTCC)基陶瓷管壳开展了国产化替代研究,采用化学镀镍钯金工艺提高焊盘的焊接可靠性。通过键合强度、耐焊性和气密性的检测,对管壳及镀层质量进行全面评估,并通过温度循环及多批次重复验证,保证了陶瓷管壳的稳定性、一致性。结果表明,所选用的国产可化镀LTCC材料具有较好的应用前景。A localization of LTCC based ceramic package is studied by using ENEPIG process to improve the soldering reliability of solder pads.The quality of the package and metallic coating is comprehensively evaluated by bonding strength,resistance soldering and hermeticity testing.Through temperature cycling and repeated validation of multiple batches,the stability and consistency of the ceramic package are demonstrated.The results indicate that the selected domestic chemically plated LTCC have good application prospects.

关 键 词：低温共烧陶瓷 国产化 化学镀钯金 可靠性 

分 类 号：TN605[电子电信—电路与系统]