LTCC电路板化学沉积ENEPIG层焊盘内缩失效分析  

Failure Analysis of Pad Recession in ENEPIG Layer of LTCC Circuit Boards by

作　　者：王玉廷 韩锡正 WANG Yuting;HAN Xizheng(The 2nd Research Institute of CETC,Taiyuan 030024,China)

机构地区：[1]中国电子科技集团公司第二研究所,太原030024

出　　处：《电子工艺技术》2025年第2期28-30,共3页Electronics Process Technology

摘　　要：以低温共烧陶瓷(LTCC)共晶焊接时焊盘内缩为例,通过宏观形貌检查、X-ray膜厚衍射测试、电子显微镜扫描、X-ray能谱分析及截面分析等方法,探索失效原因与机理。通过元素面扫描图像发现镍层表面有异常氧化与磷聚集现象,这是最终导致焊盘表面共晶焊接时焊料内缩的主要诱因。Taking the pad shrinkage during eutectic soldering of low-temperature co-fired ceramics as an example,the failure causes and mechanisms are explored through macroscopic morphology,X-ray film thickness diffractometer,scanning electron microscope,X-ray energy spectrum analysis and cross-sectional analysis.Based on elemental surface scanning images,abnormal oxidation and phosphorus aggregation phenomena are observed on the surface of the nickel layer,which is the main cause that ultimately leads to the inward shrinkage of the solder during eutectic soldering on the surface of the bonding pad.

关 键 词：低温共烧陶瓷 化镀镍钯金 焊盘内缩 

分 类 号：TN605[电子电信—电路与系统]