焊点柯肯达尔孔洞开裂问题研究  

Research on Cracking of Solder Joints Caused by Kirkendall Holes

作　　者：王玉忠 徐军军 李慧[2] WANG Yuzhong;XU Junjun;LI Hui(CEPREI,Guangzhou 511370,China;Patent Examination Cooperation Guangdong Center of the Patent Office,Guangzhou 510700,China)

机构地区：[1]工业和信息化部电子第五研究所,广东广州511370 [2]国家知识产权局专利局专利审查协作广东中心,广东广州510700

出　　处：《电子质量》2025年第2期77-81,共5页Electronics Quality

摘　　要：孔洞是焊点内部较为常见的缺陷,它的存在会导致焊点机械强度降低,带来焊点失效风险。对电阻焊点失效案例进行了分析研究,利用聚焦离子束观察到焊点金属间化合物部位存在柯肯达尔孔洞,孔洞的存在降低了焊接点的力学完整性。当受到外力作用时,焊点的焊接界面处开裂。进一步研究发现,该柯肯达尔孔洞是焊料或焊接工艺异常所致,与服役过程热影响和电阻镀层无关。在产品生产过程中,应加强焊接过程的管控,避免因焊接空洞等而影响产品的质量。Holes are a common defect inside solder joints,which can lead to a decrease in mechanical strength and a risk of solder joint failure.Failure cases of resistance solder joints are analyzed and studied.It is observed that there are Kirkendall holes in the intermetallic compound part of solder joints by focused ion beam,which reduces the mechanical integrity of the solder joint.When subjected to external forces,cracks occur at the welding interface.Further research has found that the Kirkendall holes are caused by abnormal welding materials or welding processes,and are not related to the thermal effects during service and the resistance coating.In the production process of the product,the control of the webling process should be strengthened to avoid the effect of welding holes on product quality.

关 键 词：焊点 柯肯达尔孔洞 机械强度 失效分析 

分 类 号：TN60[电子电信—电路与系统] TB114.39[理学—概率论与数理统计]