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作 者:周民 王国中 侯世维 赖苡析 Zhou Min;Wang Guozhong;Hou Shiwei;Lai Yixi(College of Electronic and Electrical Engineering,Shanghai University of Engineering Science,Shanghai 201620,China)
机构地区:[1]上海工程技术大学电子电气工程学院,上海201620
出 处:《应用激光》2025年第1期134-142,共9页Applied Laser
基 金:国家重点研发计划资助项目(2019YFB1802700)。
摘 要:点胶厚度直接影响着SIM卡的抗弯折能力以及可用性。由于点胶厚度测量工艺复杂,工业生产中一般使用千分表测量其厚度,但该方法效率较低且易损坏点胶表面。为提高点胶厚度测量的精度和效率,提出一种基于激光点云的高精度点胶厚度测量方法。首先,通过线激光轮廓传感器获取点胶深度图,并对图中缺失像素进行图像修复;其次,采用NCC模板匹配定位并分割出每个点胶后,对其进行点云重建提取;然后,利用统计滤波剔除离群值;最后,使用改进的RANSAC算法拟合出最佳平面方程参数,并计算点胶上平面和底面的高度信息,作为点胶的厚度。将该方法测得的点胶厚度与千分表测得的厚度数据进行对比,并进行重复性试验,结果表明:测量10组不同点胶,最大平均误差小于±6μm,重复性小于0.3%。测试结果验证了该方法具备良好的精度和稳定性,满足工业测量需求。The thickness of adhesive significantly impacts the bending resistance and functionality of SIM cards.Traditional measurement methods,such as using a micrometer,are inefficient and can damage the adhesive surface.To enhance the accuracy and efficiency of adhesive thickness measurement,this paper introduces a high-precision method based on laser point cloud technology.Firstly,a line laser profile sensor is used to obtain the depth map of the glue,and missing pixels in the image are repaired.Then,NCC template matching is employed to locate and segment each glue spot,and point cloud reconstruction is performed.Next,statistical filtering is applied to eliminate outliers.Finally,an improved RANSAC algorithm is utilized to fit the best plane equation parameters,and the height information of the top and bottom surfaces of the glue is calculated as the glue thickness.The glue thickness obtained by this method is compared with the measurements from the micrometer,and repeat tests are conducted.The results show that for 10 groups of different glues,the maximum average error is less than±6μm,and the repeatability is less than 0.3%.The test results validate that this method has good accuracy and stability,meeting the requirements of industrial measurement.
关 键 词:点胶测量 激光点云 NCC模板匹配 RANSAC拟合
分 类 号:TN929.1[电子电信—通信与信息系统] TP391.41[电子电信—信息与通信工程]
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