乙基纤维素影响下的微米银焊膏和纳米银焊膏烧结对比研究  

Comparative Study on the Sintering of Ag Microparticles Solder Paste and Ag Nanoparticles Solder Paste Under the Influence of Ethyl Cellulose

作　　者：喻龙波 夏志东[1] 邓文皓 林文良 周炜 郭福[1,3] YU Longbo;XIA Zhidong;DENG Wenhao;LIN Wenliang;ZHOU Wei;GUO Fu(College of Materials Science and Engineering,Beijing University of Technology,Beijing 100124,China;Chongqing Qunwin Electronic Materials Co.,Ltd.,Chongqing 408102,China;College of Mechanical andElectrical Engineering,Beijing Information Science&Technology University,Beijing 102206,China)

机构地区：[1]北京工业大学材料科学与工程学院,北京100124 [2]重庆群崴电子材料有限公司,重庆408102 [3]北京信息科技大学机电工程学院,北京102206

出　　处：《电子与封装》2025年第3期16-24,共9页Electronics & Packaging

基　　金：国家自然科学基金(61904008)。

摘　　要：微米银(Ag MPs)焊膏和纳米银(Ag NPs)焊膏因其低温烧结、高温服役的特点而成为最有可能用于高温封装的连接材料。研究了乙基纤维素对Ag MPs和Ag NPs焊膏烧结结果的影响,分析了相同条件下2组焊膏烧结结果存在差异的原因。结果表明,在无压、250℃、空气条件下,添加质量分数为5%的乙基纤维素,2组焊膏的烧结性能较好,Ag MPs焊膏烧结所得接头强度和薄膜电阻率为8.57 MPa和4.25μΩ·cm,Ag NPs焊膏烧结所得接头强度和薄膜电阻率为32.89 MPa和7.71μΩ·cm。接头界面和薄膜微观形貌表明,烧结后颗粒间形成的烧结颈和烧结组织均匀性是影响连接强度的关键因素,而烧结组织致密度则是影响导电性的主要因素。研究结果为进一步提高银焊膏烧结接头强度和烧结薄膜导电性提供了参考。The Ag microparticles(Ag MPs)solder paste and the Ag nanoparticles(Ag NPs)solder paste are the most likely connection materials for high-temperature packaging due to their characteristics of low-temperature sintering and high-temperature service.The influence of ethyl cellulose on the sintering results of Ag MPs solder paste and Ag NPs solder paste is studied,and the reasons for the differences in sintering results between the 2 groups of solder pastes under the same conditions are analyzed.The results show that the sintering properties of the 2 groups of solder pastes are better with the addition of ethyl cellulose with a mass fraction of 5%under the conditions of no pressure,250℃,and air,the joint strength and film resistivity obtained by sintering of Ag MPs solder paste are 8.57 MPa and 4.25μΩ·cm,and the joint strength and film resistivity obtained by sintering of Ag NPs solder paste are 32.89 MPa and 7.71μΩ·cm.The microstructures of the joint interface and film show that the sintering neck formed between particles after sintering and the uniformity of sintered microstructure are key factors affecting the bonding strength,while the density of sintered microstructure is the main factor affecting the electrical conductivity.The research results provide a reference for further improving the strength of silver solder paste sintered joints and the electrical conductivity of the sintered film.

关 键 词：乙基纤维素 微米银焊膏 纳米银焊膏 烧结性能 

分 类 号：TN305.94[电子电信—物理电子学] TG425[金属学及工艺—焊接]