表面贴装大功率器件热匹配问题可靠性仿真  

Reliability Simulation of Thermal Matching Issues in Surface-Mounted High-Power Devices

作　　者：胡运涛 苏昱太 刘灿宇 刘长清 HU Yuntao;SU Yutai;LIU Canyu;LIU Changqing(School of Mechanics,Civil Engineering and Architecture,Northwestern Polytechnical University,Xi’an 710072,China;School of Mechanical Science and Technology,Huazhong University of Science and Technology,Wuhan 430074,China)

机构地区：[1]西北工业大学力学与土木建筑学院,西安710072 [2]华中科技大学机械科学与工程学院,武汉430074

出　　处：《电子与封装》2025年第3期95-99,共5页Electronics & Packaging

基　　金：陕西省科技厅秦创原创新创业人才项目(QCYRCXM-2022-306);重庆市自然科学基金(CSTB2022NSCQ-MSX0574);国防重点实验室开放基金2022-JCJQ-LB-006(6142411232212);电子制造与封装集成湖北省重点实验室开放基金(EMPI2024002)。

摘　　要：针对表面贴装大功率器件中不同材料间热膨胀系数差异所引起的热力学不匹配问题,在不同升温速率下对关键互连结构的寿命与可靠性进行分析。探讨了材料热膨胀不匹配对器件性能和长期可靠性所带来的潜在影响。利用Anand本构模型详细描述了SAC305焊料的力学特性,重点分析了其应力应变与温度特性。基于Coffin-Manson模型进行了寿命评估,系统分析了焊料的疲劳失效与塑性应变的关系。仿真结果表明,温度变化速率越大,热力不匹配越明显,导致元器件内部产生较大的热应力和热疲劳效应,使得元器件寿命及可靠性降低。To address the thermomechanical mismatch problem caused by differences in the coefficient of thermal expansion between different materials in surface-mounted high-power devices,the lifetime and reliability of key interconnection structures are analyzed under different heating rates.The potential impact of material thermal expansion mismatches on device performance and long-term reliability is explored.The mechanical properties of SAC305 solder are investigated in detail through the Anand constitutive model,focusing on the stress-strain and temperature characteristics.The lifetime assessment is conducted based on the Coffin-Manson model,and the relationship between solder fatigue failure and plastic strain is systematically analyzed.The simulation results indicate that the larger the temperature change rate,the more obvious thermal-mechanical mismatch becomes,resulting in significant thermal stress and fatigue effects within the components,which leads to a decrease in their lifetime and reliability.

关 键 词：表面贴装器件 Anand本构模型 Coffin-Manson模型 可靠性分析 

分 类 号：TN406[电子电信—微电子学与固体电子学]