SAC305/薄化学镍钯金焊点的界面反应及可靠性研究进展  

Research Progress on Interfacial Reaction and Reliability of SAC305/Thin ENEPIG Solder Joint

作　　者：展尚松 鲍明东[2] 王帅康 杨文灏 林乃明[1] 吴泓均 ZHAN Shangsong;BAO Mingdong;WANG Shuaikang;YANG Wenhao;LIN Naiming;WU Hongjun(School of Materials Science and Engineering,Taiyuan University of Technology,Taiyuan 030024,China;School of Materials and Chemical Engineering,Ningbo University of Technology,Ningbo 315211,China)

机构地区：[1]太原理工大学材料科学与工程学院,山西太原030024 [2]宁波工程学院材料与化学工程学院,浙江宁波315211

出　　处：《热加工工艺》2025年第5期6-12,共7页Hot Working Technology

摘　　要：化学镍钯金(ENEPIG)是一种对电路板及微电子芯片、进行表面处理以提高焊接性能的重要工艺。传统ENEPIG体系中Ni(P)厚度较厚(4~7μm),在应用中存在电阻过大、电信号退化以及潜在的桥连问题,因此开发薄ENEPIG以替代传统ENEPIG已成为封装应用中的新问题。目前,Sn-3.0Ag-0.5Cu(SAC305)焊料综合性能较好,是应用最为广泛的商业无铅焊料。然而在SAC305/薄ENEPIG的界面反应中,Ni(P)层在回流后会耗竭,IMC生长快,不利于焊点的导电性及机械可靠性。本文对SAC305/薄ENEPIG的界面反应机理进行了介绍,总结了Ni(P)厚度、Pd(P)厚度及其P含量等对焊点界面结构及形貌的影响,分析了SAC305/薄ENEPIG焊点的导电性及抗冲击性能,以期为薄ENEPIG的开发提供一定参考。Electroless nickel/electroless palladium/immersion gold(ENEPIG)is an important process for surface treatment of circuit boards and microelectronic chips to improve soldering performance.The thickness of Ni(P)in the traditional ENEPIG system is relatively thick(4-7μm),which contributes to large resistance,electrical signal degradation and potential bridging problems in the application.Therefore,the development of thin ENEPIG to replace traditional ENEPIG has become an emerging issue in packaging applications.At present,the overall performance of Sn-3.0Ag-0.5Cu(SAC305)solder is good,and it is the most widely used commercial lead-free solder.However,in the interface reaction of SAC305/thin ENEPIG,the Ni(P)layer will be depleted after reflow,and the IMCs grow fast,which reduces the conductivity and mechanical reliability of the solder joints.This review introduced the interface reaction mechanism of SAC305/thin ENEPIG,and the effect of Ni(P)thickness,Pd(P)thickness and P content on the interface structure and morphology of the solder joint was summarized.Finally,the electrical conductivity and impact resistance of SAC305/thin ENEPIG solder joints were analyzed to provide reference for the development of thin ENEPIG.

关 键 词：封装 薄化学镍钯金 界面反应 可靠性 

分 类 号：TG457.13[金属学及工艺—焊接] TG454