IC载板覆晶封装金球键合失效分析与改善  

Analysis and improvement on the failure of Au-Au interconnection in FC packaging of IC substrate

作　　者：张海 张明明 郁丁宇 张健 徐俊子 孙炳合 ZHANG Hai;ZHANG Mingming;YU Dingyu;ZHANG Jian;XU Junzi;SUN Binghe(Jiangsu Bomin Electronic Co.,Ltd.,Yancheng 224000,Jiangsu,China)

机构地区：[1]江苏博敏电子有限公司,江苏盐城224000

出　　处：《印制电路信息》2025年第3期47-51,共5页Printed Circuit Information

摘　　要：主要介绍在倒装芯片键合过程中,芯片与封装载板键合失效的改善方法。经化学镍钯金表面处理的封装载板与芯片进行金-金键合(GGI)连接时发生失效。利用GGI基本原理和推球测试方法,对该问题展开分析并探究制定改善措施。研究发现,在不了解客户封装过程条件的情况下,对封装载板产品的制程参数选择不当,将直接影响封装信赖性问题。封装载板表面的油墨固化不充分,即内部仍存在有机物挥发残留或聚合不充分等现象;在封装过程中,客户端预热温度高于油墨固化温度,芯片键合加热时,部分有机物继续挥发释放,导致焊盘表面污染,进而引发金球键合失效。This article mainly introduces the methods for improving bonding failure between chips and substrate during the flip chip bonding process.This article uses the basic principle of GGI(Gold to Gold interconnection)and the ball shear test method to analyze and improve the GGI connection failure problem between substrate with ENEPIG(Electroless Nickel Electroless Palladium Immersion Gold)surface treatment and chips.Research has found that:Improper selection of process parameters for substrate products without sufficient understanding of customer packaging process conditions can directly affect packaging reliability issues.In this article,the ink on the surface of the substrate is not fully cured,that is,there are still organic volatile residues inside,or insufficient polymerization and other phenomena.If the preheating temperature of the client during the packaging process is higher than the ink curing temperature,some organic matter will continue to evaporate and release during the chip bonding heating,causing contamination of the pad surface and resulting in the failure of GGI.

关 键 词：覆晶封装 金-金键合 推球测试 有机挥发物 

分 类 号：TN406[电子电信—微电子学与固体电子学]