电子封装铜键合丝的研究进展  

Research progress on copper bonding wire in electronic packaging

作　　者：谢道春 甘贵生[1] 马勇冲 李方樑 朱俊雄 窦俊丰 张嘉俊 夏大权 徐向涛 XIE Daochun;GAN Guisheng;MA Yongchong;LI Fangliang;ZHU Junxiong;DOU Junfeng;ZHANG Jiajun;XIA Daquan;XU Xiangtao(Chongqing Municipal Engineering Research Center of Institutions of Higher Education for Special Welding Materials and Technology(Chongqing University of Technology),Chongqing 400054,China;Chongqing Pingwei Industrial Co.,Ltd.,Chongqing 405200,China)

机构地区：[1]重庆理工大学重庆特种焊接材料与技术高校工程技术研究中心,重庆400054 [2]重庆平伟实业股份有限公司,重庆405200

出　　处：《中国有色金属学报》2025年第3期758-784,共27页The Chinese Journal of Nonferrous Metals

基　　金：国家自然科学基金资助项目(62274020);重庆市教委科技项目(KJZD-K202101101,KJZD-M202301102);重庆市技术创新与应用发展重大专项(CSTB2024TIAD-STX0011)。

摘　　要：无论是先进封装还是功率封装,高电流密度和更高服役温度将是电子封装的主要趋势。本文综述了当前主流的纯铜、铜合金及镀钯铜键合丝的研究进展,提出利用金、银固有的键合优势开发金包铜、银包铜新型双金属或多金属键合丝材料;通过键合丝进给系统辅热,可以在软化键合丝的同时降低键合的下压力;开发飞秒激光-热声键合新装备,以实现键合丝快速、微区加热,从而降低铜键合丝氧化和硬度。键合丝是集成电路等半导体封装的关键性材料,低成本、高导热的铜键合丝具有明显的优势,势必继续抢占键合丝的市场份额,需加强对大电流、高温及多物理场等极端条件下铜键合丝电迁移、热迁移的可靠性研究,多方协同推动国产化铜键合丝的研究与应用。Regardless of whether it pertains to advanced packaging or power packaging,high current density and elevated service temperatures will remain the predominant themes in this field.This paper reviews and summarizes the current mainstream research on bare copper bonding wire,copper alloy bonding wire,and palladium-coated copper bonding wire.It is emphasized that the development of new bimetallic or polymetallic bonding wire materials is proposed,capitalizing on the intrinsic advantages of gold and silver in terms of bonding.Furthermore,it is recommended that the bonding wire feeding system incorporate auxiliary heating to soften the bonding wire while simultaneously reducing the required downforce during the bonding process.Additionally,there is potential for developing femtosecond laser-thermoacoustic bonding equipment aimed at achieving rapid bond formation along with micro-zone heating to mitigate oxidation and hardness issues associated with copper bonding wires.There exists a pressing need to enhance reliability studies concerning copper bonding wires under extreme conditions—such as high currents,elevated temperatures,and various physical fields—with particular attention given to electromigration and thermomigration phenomena.It should be noted that bonded wires are critical materials in semiconductor packaging applications such as integrated circuits.The low-cost yet highly thermally conductive nature of copper bonded wires presents significant advantages;thus,they are poised to continue capturing market share within this domain.Consequently,promoting research into and application of domestic copper bonded wires becomes imperative.

关 键 词：电子封装 铜键合丝 双金属 高电流密度 可靠性 

分 类 号：TG425.1[金属学及工艺—焊接]