晶圆校准器吸盘动力学建模与残余振动优化  

Dynamic modeling and residual vibration optimization of wafer alignment chuck

作　　者：刘暾东 唐之晨 王若宇 陈锃琰 刘长胜 Liu Tundong;Tang Zhichen;Wang Ruoyu;Chen Zengyan;Liu Changsheng(Pen-Tung Sah Institute of Micro-Nano Science and Technology,Xiamen University,Xiamen 361102,China;Xiamen Tobacco Industrial Co.,Ltd,Xiamen 361022,China)

机构地区：[1]厦门大学萨本栋微米纳米科学技术研究院,厦门361102 [2]厦门烟草工业有限责任公司,厦门361022

出　　处：《仪器仪表学报》2025年第1期227-235,共9页Chinese Journal of Scientific Instrument

摘　　要：晶圆校准器是确保晶圆在加工过程实现精准定位的重要设备,其定位精度易受晶圆校准器吸盘高速旋转启停时加速度突变产生的残余振动影响。为解决这一问题,首先分析了晶圆校准器吸盘表面的接触特性,建立晶圆校准器吸盘动力学数学模型,通过仿真求解运动过程中晶圆与晶圆校准器吸盘的接触状态和形变情况。在此基础上,引入系统真空度与最大旋转速度、最大旋转加速度,获得在不同加加速度作用下晶圆的振幅与模态,求解加速度约束方程,进而利用三阶Bezier曲线构造对称的晶圆校准器速度曲线。同时,针对晶圆校准器电机在加速阶段与减速阶段的特性差异,基于Pareto多目标遗传算法优化对称速度曲线参数,构造非对称速度曲线,进一步抑制晶圆校准器吸盘的残余振动,提高晶圆校准器的定位精度和工作效率。最后,通过仿真实验验证了非对称速度曲线在工作效率上的改进;同时搭建了晶圆校准器实物装置,设计实物实验验证其相对于传统的速度曲线在定位精度和工作效率上的提升。实验结果表明:本文设计的非对称速度曲线充分考虑晶圆校准器吸盘动力学特性,与传统的速度曲线相比,可以有效减小吸盘残余振动,将校准器的定位精度提高至0.008 mm,缩短工作时间0.14 s,验证本文所提方法有效。The wafer alignment is a crucial piece of equipment that ensures precise positioning of wafers during processing.However,its positioning accuracy is often affected by residual vibrations caused by abrupt changes in acceleration during the high-speed start and stop of the chuck.To address this issue,this study first analyzes the contact characteristics of the chuck surface,establishes a mathematical dynamic model of the wafer alignment chuck,and simulates the contact state and deformation of the wafer and chuck during motion.Based on this analysis,the relationship between the system′s vacuum degree,maximum rotational speed,and maximum rotational acceleration is introduced to determine the amplitude and mode of the wafer under various acceleration conditions.The acceleration constraint equation is then solved,and a symmetric velocity curve for the wafer alignment is constructed using a third-order Bezier curve.Furthermore,considering the differences in motor characteristics during the acceleration and deceleration phases,the parameters of the symmetric velocity curve are optimized using the Pareto multi-objective genetic algorithm to construct an asymmetric velocity curve.This approach further suppresses the residual vibrations of the chuck and improves the positioning accuracy and operational efficiency of the wafer alignment.Finally,simulation experiments verify the improvement in operational efficiency achieved by the proposed asymmetric velocity curve.A physical wafer alignment device is also built,and physical experiments demonstrate the enhancements in positioning accuracy and operational efficiency compared to traditional velocity curves.The experimental results show that the proposed asymmetric velocity curve fully considers the dynamic characteristics of the chuck.Compared to traditional velocity curves,it effectively reduces residual vibrations,improves the alignment accuracy to 0.008 mm,and shortens the operation time by 0.14 seconds,validating the effectiveness of the proposed method.Wafer alignment i

关 键 词：晶圆校准器 动力学建模 残余振动优化 

分 类 号：TH162[机械工程—机械制造及自动化] TP242.2[自动化与计算机技术—检测技术与自动化装置]