等温时效对Cu-Sn IMC焊点的组织与性能影响  

Effect of isothermal aging on microstructure and properties of Cu-Sn IMC solder joints

作　　者：孙磊[1,2] 王文昊 王静 虞佳鑫[1] 张亮 姜加伟 SUN Lei;WANG Wenhao;WANG Jing;YU Jiaxin;ZHANG Liang;JIANG Jiawei(School of Mechanical Engineering and Rail Transit,Chang Zhou University,Changzhou,213164,China;Quick Intelligent Equipment Co.,Ltd,Changzhou,213164,China;School of Materials Science and Engineering,Xiamen University of Technology,Xiamen,361024,China)

机构地区：[1]常州大学,机械与轨道交通学院,常州213164 [2]快克智能装备股份有限公司,常州213164 [3]厦门理工学院,材料科学与工程学院,厦门361024

出　　处：《焊接学报》2025年第3期82-88,共7页Transactions of The China Welding Institution

基　　金：国家自然科学基金项目(52305338);江苏省自然科学基金项目(BK20210853);中国博士后科学基金项目(2023M741485);江苏省青年科技人才托举工程(JSTJ-2024-027);常州市科技计划项目(CJ20230033);常州市领军型创新人才引进培育项目(CQ20220115)。

摘　　要：采用瞬时液相键合工艺制备芯片叠层互连用Cu-Sn金属间化合物(intermetallic compound,IMC)焊点,对IMC焊点进行150℃等温时效处理,研究时效条件下纳米Al颗粒对Cu-Sn IMC焊点的组织演化规律及力学性能.结果表明,添加微量的纳米Al颗粒可有效抑制键合Cu-Sn IMC焊点中界面层的过快生长和空洞的产生,经等温时效处理后,Cu-Sn-Cu和Cu-Sn0.3Al-Cu IMC焊点中Cu3Sn界面层均逐渐增厚,但是Cu-Sn0.3Al-Cu IMC焊点中Cu3Sn层的生长速率始终低于Cu-Sn-Cu焊点,且空洞数量也明显少于Cu-Sn-Cu焊点.当等温时效300 h时,两种IMC焊点的抗剪强度为23.1和26.5 MPa,随着时效时间增加到1500 h后,两种IMC焊点的抗剪强度下降到13.4和17.6 MPa,分别下降44.2%和35.3%.在时效初始阶段,Cu-Sn-Cu和Cu-Sn0.3Al-Cu IMC焊点的断口形貌呈现穿晶断裂,随着时效时间的增加,Cu-Sn-Cu IMC焊点的断口形貌逐渐转变为沿晶断裂.对于Cu-Sn0.3Al-Cu IMC焊点,断口形貌仍为穿晶断裂.创新点:(1)通过添加纳米Al颗粒抑制芯片堆叠互连IMC焊点中界面层的生长和空洞的产生.(2)分析了等温时效条件下IMC焊点的组织演化规律及力学性能.Cu-Sn IMC solder joints for chip stack interconnects were prepared via transient liquid phase bonding and subsequently subjected to isothermal aging at 150℃.The microstructure evolution and mechanical properties of Cu-Sn IMC solder joints modified with Al nanoparticles were studied under aging conditions.The results show that the rapid growth of interfacial layer and the formation of voids in Cu-Sn IMC solder joints can be effectively inhibited by adding trace amounts of Al nanoparticles.During isothermal aging,the Cu3Sn interfacial layer in both Cu-Sn-Cu and Cu-Sn0.3Al-Cu IMC solder joints gradually thickened,but the growth rate of Cu3Sn layer in Cu-Sn0.3Al-Cu IMC solder joints was always lower than that in Cu-Sn-Cu solder joints,and the voids were significantly less than that in Cu-Sn-Cu solder joints.After 300 h of aging,the shear strengths of the two IMC solder joints were 23.1 and 26.5 MPa,respectively.When the aging time was extended to 1500 h,the shear strengths of the two IMC solder joints decreased to 13.4 and 17.6 MPa,representing reductions 44.2%and 35.3%,respectively.At the initial aging stage,the fracture morphology of Cu-Sn-Cu and Cu-Sn0.3Al-Cu IMC solder joints exhibited transgranular fracture.As aging progressed,the fracture morphology of Cu-Sn-Cu IMC solder joints gradually transitioned to an intergranular fracture,whereas Cu-Sn0.3Al-Cu IMC solder joints retained its transgranular characteristics.Highlights:(1)The growth of interfacial layer and the formation of voids in IMC solder joints were inhibited by adding trace amounts of Al nanoparticles.(2)The microstructure evolution and mechanical properties of IMC solder joints were analyzed under isothermal aging.

关 键 词：三维封装 金属间化合物焊点 等温时效 组织演化 抗剪强度 

分 类 号：TG425[金属学及工艺—焊接]