漫话半导体先进封装技术中的新网版印刷(九)  

New Screen Printing in Advanced Packaging Technology for Semiconductors(Part 9)

作　　者：熊祥玉 巢亚平 陈港能 李蓉 XIONG Xiangyu;CHAO Yaping;CHEN Gangneng;LI Rong

机构地区：[1]不详

出　　处：《丝网印刷》2025年第4期22-27,共6页Screen Printing

摘　　要：社会各行业对高性能计算的需求不断提升。Chiplet能够高效处理复杂计算,同时又具节能性。Chiplet为芯片用户创造前所未有的机遇,进入Chiplet先进封装技术的网版印刷迎来新的机遇和责任,在C4倒装焊技术中,网版印刷高温助焊剂的工艺,可以实现芯片与基板的互连技术。The demand for high-performance computing in various sectors of society continues to increase.Chiplet can efficiently handle complex calculations while saving energy.Chiplet creates unprecedented opportunities for chip users,ushering in new opportunities and responsibilities for screen printing technology that enters Chiplet's advanced packaging technology,In the C4 flip-chip bonding technology,the process of screen-printing high-temperature flux can achieve the interconnection technology between the chip and the substrate.

关 键 词：Chiplet先进封装技术 高性能计算 网版印刷 C4技术 

分 类 号：F42[经济管理—产业经济]