PCB盲孔底部互连失效原因分析(Ⅰ)  

Analysis of the Causes of Interconnection Failure at the Bottom of Blind Vias in PCBs(Ⅰ)

作　　者：李晓红 牟星宇 黄亚运 邵永存 章晓冬 刘江波 Li Xiaohong;Mou Xingyu;Huang Yayun;Shao Yongcun;Zhang Xiaodong;Liu Jiangbo

机构地区：[1]上海天承化学有限公司,上海201500

出　　处：《印制电路资讯》2025年第2期50-52,共3页Printed Circuit Board Information

摘　　要：本文对一款耐电流测试(HCT)失效的任意层(anylayer)互连结构PCB的附连板进行透射电镜(TEM)和能量色散谱(EDS)分析,找出失效根因。The article identified the interconnection failure cause of the high current test(HCT)on an anylayer coupon attached to a printed circuit board by means of Transmission Electron Microscopy(TEM)and Energy-Dispersive Spectroscopy(EDS).

关 键 词：盲孔 互连失效 HCT测试 TEM EDS 

分 类 号：TN4[电子电信—微电子学与固体电子学]