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作 者:常选委 韩志伟 李玖娟 王守绪 李长生 Chang Xuanwei;Han Zhiwei;Li Jiujuan;Wang Shouxu;Li Changsheng
出 处:《印制电路资讯》2025年第2期75-78,共4页Printed Circuit Board Information
基 金:2024HY001TD002、2024YFB4711300和2024B1212030001项目支持。
摘 要:在光模块印制电路板制作中,边缘金手指中心到边距离为关键尺寸,光模块产品传输速率越高,关键尺寸公差越严格,传统印制电路板生产工艺和常规做法难以实现高精度公差管控,操作难度系数高,良率低,生产成本极高,不能按期保质足数交付,带来客户抱怨,严重者失去客户。本文通过对影响精度的设备、工艺、流程设计等方面进行解析,并根据设备、工艺流程特点进行灵活运用,创新思维,从本质上解决瓶颈问题,取得了良好的经济效益。In the production of optical module printed circuit boards,the distance from the center of the edge gold finger to the edge is the critical dimension.Higher the transmission rate of the optical module product,the tighter the tolerance for the critical dimension is required.Traditional printed circuit board production processes and conventional practices are difficult to achieve high precision tolerance control,with high operational difficulty coefficient,low yield rate,and extremely high production cost.They cannot deliver on time,in full quantity,and of good quality,leading to customer complaints,and in severe cases,the loss of customers.This article analyzes the factors that affect precision,such as equipment,processes,and flow design,and innovatively applies the characteristics of equipment and processes to solve the bottleneck problem from the root cause,achieving good economic benefits.
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