铜箔晶体结构与可加工性研究  

Study on the crystal structure and workability of copper foil

作　　者：杨红光 齐素杰 朱洪波 王泥铭 Yang Hongguang;Qi Sujie;Zhu Hongbo;Wang Niming

机构地区：[1]九江德福科技股份有限公司,江西九江332000

出　　处：《印制电路资讯》2025年第2期79-82,共4页Printed Circuit Board Information

摘　　要：铜箔作为印制电路板(PCB)制造中的关键材料,其晶体结构对蚀刻性能和最终产品质量具有重要影响。为探讨不同晶体结构铜箔在PCB制造中的加工性能,本文通过实验分析了2种晶体结构的电解铜箔,并研究了其在蚀刻工艺中的表现。研究结果显示,晶体尺寸较小的铜箔具有显著更高的蚀刻因子,表明其在蚀刻过程中更易实现精准控制,具备更优的加工性能。该发现不仅深化了对铜箔晶体结构与其蚀刻性能关系的认识,还为优化PCB制造工艺、提高产品质量提供了理论支持与实践依据。Copper foil,as a critical material in the manufacture of printed circuit boards(PCBs),greatly influences etching performance and the final product quality due to its crystal structure.This study investigates the processing performance of copper foils with different crystal structures in PCB manufacturing through experimental analysis of two types of copper foils.The study examines their behavior during the etching process.The results reveal that copper foil with smaller crystal sizes exhibits significantly higher etching factors,suggesting enhanced etching precision and superior processing performance.These findings not only enhance the understanding of the relationship between the crystal structure of copper foil and its etching performance but also provide theoretical support and practical guidance for optimizing PCB manufacturing processes and improving product quality.

关 键 词：铜箔 晶体结构 蚀刻性能 蚀刻因子 PCB加工 

分 类 号：TN4[电子电信—微电子学与固体电子学]