基于程序实现Wafer MAP角度旋转的方法分析  

Analysis of the Method of Wafer Map Angle Rotation with Program

作　　者：李建超 裴仁国 蔺鹏程 LI Jianchao;PEI Renguo;LIN Pengcheng(Wuxi CMC Electronics Co.,Ltd.,Jiangsu 214000,China.)

机构地区：[1]无锡中微腾芯电子有限公司,江苏214000

出　　处：《电子技术(上海)》2025年第1期28-29,共2页Electronic Technology

摘　　要：阐述晶圆缺口在晶圆边缘的切边或V型缺口形式,及其在加工过程中各工序中的定位方法。在晶圆测试中,通过自动化技术对晶圆测试图进行旋转,在不改变硬件的基础上,达到了客户的出图标准。This paper describes how wafer notches are located at the edge of the wafer in the form of trimming or V-shaped notches,and are used as positioning methods in various processes during the manufacturing process.In wafer testing,without changing the hardware,it uses automation technology to rotate the wafer test diagram to meet the customer's drawing standards.

关 键 词：集成电路制造 晶圆测试 晶圆缺口 定位方法 

分 类 号：TN405[电子电信—微电子学与固体电子学] TN407