半导体封装高端模塑料的最新研究进展  

Recent Research Progress on High-end Molding Compounds for Semiconductor Packaging

作　　者：黄丽娟[1] 冯亚凯[2] Huang Lijuan;Feng Yakai(Chemical Industry Press Co.,Ltd.,Beijing,100011;College of Chemical Engineering,Tianjin University,Tianjin,300350)

机构地区：[1]化学工业出版社有限公司,北京100011 [2]天津大学化工学院,天津300350

出　　处：《当代化工研究》2025年第6期6-9,共4页Modern Chemical Research

摘　　要：模塑料是半导体封装关键材料,为半导体元器件提供物理保护,增强电路的可靠性,改善电气性能。为了满足第三代半导体的高功率密度、高频率及高工作温度等发展趋势,亟需研发高端模塑料。通过综述高端模塑料的最新研究进展,重点介绍了高玻璃化温度塑封料、高导热塑封料和本征阻燃塑封料。高端塑封料研发必将推动半导体封装技术的发展,为未来更高需求提供新封装材料。Molding compound is a key material for semiconductor packaging,providing physical protection for semiconductor components,enhancing circuit reliability,and improving electrical performance.In order to meet the development trends of high power density,high frequency,and high operating temperature of third-generation semiconductors,there is an urgent need to develop high-end molding compounds.A review of the latest research progress in high-end molding materials,with a focus on high glass transition temperature plastic sealants,high thermal conductivity plastic sealants,and intrinsic flame retardant plastic sealants.The research and development of high-end plastic packaging materials will undoubtedly promote the development of semiconductor packaging technology and provide new packaging materials for higher demand in the future.

关 键 词：模塑料 半导体 封装 玻璃化温度 导热 自修复 本征阻燃 

分 类 号：TN305[电子电信—物理电子学]