芯粒标准体系构建研究与探讨  

Research and Discussion on the Construction of Chiplet Standard System

作　　者：华松逸 魏敬和[1] 

机构地区：[1]中国电子科技集团公司第五十八研究所

出　　处：《信息技术与标准化》2025年第4期95-100,共6页Information Technology & Standardization

摘　　要：为满足芯粒技术产业化发展对标准的需求,系统梳理了国内外芯粒标准化研究的最新进展,分析了芯粒技术面临的主要挑战及应用领域。结合现有集成电路标准体系,构建了一套全面的芯粒标准体系框架,包含基础、设计、工艺、测试、产品和应用6个关键环节,旨在为芯粒技术的产业化发展提供指导性的研究方向。In order to meet the standardization demands for industrialized development of chiplet technology,the latest progress of chiplet standardization research at home and abroad was systematically sorted out,and the main challenges and application areas facing chiplet technology were analyzed.Relying on the existing integrated circuit standard system,a comprehensive framework of chiplet standard system was constructed,which contained six key aspects,namely,foundation,design,process,test,product and application,aiming to provide a guiding research direction for the industrialized development of chiplet technology.

关 键 词：集成电路 芯粒 标准体系 异构集成 

分 类 号：TN405[电子电信—微电子学与固体电子学] TN402