电镀镍/厚金防渗镀工艺研究  

Research on anti-seepage plating technology of electroplating nickel and thick gold

作　　者：赵炜 杨扬 蔺跃明 王学军 陶克 ZHAO Wei;YANG Yang;LIN Yueming;WANG Xuejun;TAO Ke(Sun Create Electronics Co.,Ltd.,Hefei 230031,AnHui,China)

机构地区：[1]四创电子股份有限公司,安徽合肥230031

出　　处：《印制电路信息》2025年第4期17-19,共3页Printed Circuit Information

摘　　要：对可能造成镍厚金渗镀的前处理方式选择因素、抗镀掩膜选型因素、掩膜制程因素、电镀镍厚金制程因素分别进行分析,制定验证改进措施,最终从前处理选择超粗化方式、优选抗镀掩膜、控制掩膜厚度、提高掩膜曝光能量、优化掩膜材料后烘温度、控制电镀参数共6个方面加以改善,从而使电镀镍/金生产良率得以提升。Based on the analysis of factors that may cause the pretreatment mode selection,mask selection,mask process and thick nickel-gold electroplating,the verification improvement measures are formulated,Finally,the yield of nickel/gold electroplating is improved from six aspects:the pretreatment mode selection is ultra-coarse,the mask thickness is optimized,the mask exposure energy is increased,the post-baking temperature of mask materials is optimized,and the electroplating parameters are controlled.

关 键 词：电镀镍/金 抗蚀材料 前处理 膜厚 渗镀 

分 类 号：TN41[电子电信—微电子学与固体电子学]