基于石墨烯的印制电路板孔金属化研究  

Research on graphene-based PCB hole metallization method

作　　者：钟珂 吴杰 陈小华[1,2] 刘建忠 ZHONG Ke;WU Jie;CHEN Xiaohua;LIU Jianzhong(Department of Materials,Hunan University,Changsha 410082,Hunan,China;Hunan Jinyang Olefin New Material Co.,Ltd.,Changsha 410329,Hunan,China)

机构地区：[1]湖南大学材料科学与工程学院,湖南长沙410082 [2]湖南金阳烯碳新材料股份有限公司,湖南长沙410329

出　　处：《印制电路信息》2025年第4期20-27,共8页Printed Circuit Information

摘　　要：提出一种基于石墨烯的印制电路板(PCB)孔金属化技术,旨在替代传统的化学沉铜工艺。在该技术实施过程中,先将PCB制板浸入石墨烯水基溶液,并进行超声处理,以确保改性后的石墨烯PCB孔壁表面形成均匀薄膜;然后从研磨时间、优化制备条件等分析不同石墨烯含量对石墨烯膜导电性和致密性的影响;扫描电子显微镜(SEM)图片和背光图片显示,孔壁成功吸附致密连续的石墨烯薄膜;石墨烯体积分数为1.5%时,电镀后孔壁的铜层致密均匀,均镀值(TP)达117.54%;且在热冲击和冷热循环试验中,铜层未出现断裂和脱落现象。试验表明,经石墨烯孔金属化后,铜层呈现优异附着力和稳定性。A graphene-based PCB hole metallization technique is proposed as an alternative to the traditional chemical copper immersion.By immersing the PCB board in a graphene water-based solution and ultrasonic treatment,graphene forms a uniform film on the surface of the modified PCB hole wall.The grinding time was explored to optimize the preparation conditions,and the effects of different graphene contents on the conductivity and densification of the graphene film were analyzed.Scanning electron microscope(SEM)images and backlight images showed that dense and continuous graphene films were successfully adsorbed on the hole wall.When the graphene content was 1.5%,the copper layer on the hole wall was dense and uniform after plating,and the average plating value(TP)was as high as 117.54%,and the copper layer did not appear to be fractured or detached in the thermal shock and hot/cold cycling experiments,which indicated that the copper layer after graphene hole metallization showed excellent adhesion and stability.

关 键 词：球磨法 石墨烯 孔金属化 金相分析 铜层 

分 类 号：TN41[电子电信—微电子学与固体电子学]