刚挠结合电路板钻孔新技术研究  

Research on new drilling technology of Rigid-Flex PCB

作　　者：魏美晓 刘怡 张伦强 刘长林 WEI Meixiao;LIU Yi;ZHANG Lunqiang;LIU Changlin(Shenzhen Newccess Industrial Co.,Ltd.,Shenzhen 518100,Guangdong,China)

机构地区：[1]深圳市柳鑫实业股份有限公司,广东深圳518100

出　　处：《印制电路信息》2025年第4期60-63,共4页Printed Circuit Information

摘　　要：刚挠结合电路板(R-FPCB)已成为印制电路板(PCB)的重要发展方向。但由于刚挠结合板是柔性电路板与刚性电路板的结合,在其组合结构中存在厚薄差异,即存在表层结构高低差,所以易引发钻孔加工瑕疵,如产生大量毛刺等,且该类问题一直未得到很好地解决。分析刚挠结合板机械钻孔产生毛刺的原因,阐述目前改善刚挠结合板毛刺的常见方法及其优缺点,提出进一步改进方案,并详细介绍该方案的技术工艺、应用及评估。Rigid-Flex PCB(R-FPCB)has become one of the mainstream of PCB development.However,because R-FPCB is the combination of flexible circuit board and rigid circuit board,there will inevitably be a difference in thickness in the combined structure,resulting in the difference in the surface structure,which is easy to cause some drilling problems,such as a large number of burrs,and such problems have not been solved.In this paper,starting from the analysis of the causes of burrs caused by mechanical drilling of R-FPCB,some common methods and drawbacks of improving burrs of In this paper,starting from the analysis of the causes of burrs caused by mechanical drilling of R-FPCB are described,and some new technologies for effectively improving burrs of starting from the analysis of the causes of burrs caused by mechanical drilling of R-FPCB are described are put forward.The research,application and evaluation of new technologies are introduced in detail.

关 键 词：刚挠结合板 钻孔 毛刺 高低差 垫板 

分 类 号：TN41[电子电信—微电子学与固体电子学]