机构地区:[1]北京中天鹏宇科技发展有限公司,北京100854
出 处:《中国胶粘剂》2025年第4期33-42,52,共11页China Adhesives
摘 要:采用四乙二醇二甲醚和四氟硼酸锂合成了一种溶剂化离子液体(ILs),并利用红外光谱对其结构进行表征。然后用合成的离子液体与双酚A型环氧树脂、固化剂、银粉以及其他助剂共混,制备了环氧导电胶。探讨了ILs质量分数对导电胶黏度、热稳定性、力学性能及导电性能的影响。研究结果表明:(1)通过对溶剂化离子液体进行红外光谱分析,证明离子液体合成成功,且没有新物质的产生;通过差示扫描量热法证实,合成的溶剂化离子液体可以促进环氧树脂开环反应,可缩短固化时间,提升固化效率;扫描电子显微镜微观形貌分析进一步证实,离子液体可以促进树脂固化收缩,形成更加致密稳定的交联密度网络,促进银粉在环氧树脂基质中的分散,并形成了均一混合物。(2)电学性能分析表明,随着ILs质量分数不断增加,导电胶的体积电阻率呈现先降低后升高的趋势。ILs可以促进更高的固化收缩,使银粉固化收缩更加紧密,促进导电通路的形成,扫描电镜试验结果也证实这一点。但过量的ILs可能对游离环氧基团固化反应产生阻碍作用,导致固化不完全,树脂收缩率降低,体积电阻率增加。(3)力学性能测试结果表明,随着ILs质量分数的不断增大,导电胶的芯片剪切强度和搭接拉伸强度呈现先升高后降低的趋势,并在ILs质量分数为15%时达到最大。(4)热学性能测试结果表明,离子液体的加入提高了导电胶的玻璃化转变温度,同时降低了线性热膨胀系数。玻璃化转变温度和线性热膨胀系数与聚合物网络分子链结构、交联密度密切相关,ILs促进环氧树脂形成致密且稳定的三维网络结构,提高了热学性能。(5)综上,当溶剂化离子液体在树脂体系中的质量分数为15%时,导电胶具有较佳的综合性能。由于离子液体具有许多优异的优点,展现出离子液体在导电胶制备领域潜在的应用前景。A solvated ionic liquid(ILs)was synthesized by using tetraethylene glycol dimethyl ether and lithium tetrafluoroborate,and its structure was characterized by infrared spectroscopy.Then,the epoxy conductive adhesive was prepared by blending the synthesized ILs with bisphenol A-type epoxy resin,curing agent,silver powder,and other additives.The influence of ILs mass fraction on the viscosity,thermal stability,mechanical properties,and conductivity of conductive adhesive was investigated.The research results showed that,(1)Infrared spectroscopy analysis of solvated ionic liquid proved the successful synthesis of ionic liquid without the generation of new substances.It was confirmed by differential scanning calorimetry that the synthesized solvated ionic liquid could promote the ring opening reaction of epoxy resin,shorten the curing time,and improve the curing efficiency.Scanning electron microscopy microstructure analysis further confirmed that ionic liquid could promote resin curing shrinkage,form a denser and more stable crosslinking density network,promoting the dispersion of silver powder in the epoxy resin matrix,and forming a homogeneous mixture.(2)Electrical performance analysis showed that as the mass fraction of ILs increased,the volume resistivity of conductive adhesive showed a trend of first decreasing and then increasing.ILs could promote higher curing shrinkage,making silver powder curing shrinkage more compact and promoting the formation of conductive pathways,as confirmed by scanning electron microscope test results.However,excessive ILs might hinder the curing reaction of free epoxy groups,resulting in incomplete curing,reduced resin shrinkage,and increased volume resistivity.(3)The mechanical performance test results showed that with the continuous increase of ILs mass fraction,the chip shear strength and lap tensile strength of conductive adhesive showed a trend of first increasing and then decreasing,and reached their maximum at an ILs mass fraction of 15%.(4)The thermal performance test results
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