钨酸钠及其复合添加剂对极薄铜箔粗化效果的影响  

Effect of Sodium Tungstate and Its Composite Additives on the Roughening Effect of Ultra-thin Copper Foil

作　　者：彭雪嵩 桂浩亮 江杰 李亚强 汪宗太 李若鹏 安茂忠 PENG Xuesong;GUI Haoliang;JIANG Jie;LI Yaqiang;WANG Zongtai;LI Ruopeng;AN Maozhong(School of Chemistry and Chemical Engineering,Harbin Institute of Technology,Harbin 150001,China;College of Chemistry,Fuzhou University,Fuzhou 350116,China;China Nuclear Power Engineering Co.,Ltd.,Beijing 100089,China)

机构地区：[1]哈尔滨工业大学化工与化学学院,哈尔滨150001 [2]福州大学化学学院,福州350116 [3]中国核电工程有限公司,北京100089

出　　处：《表面技术》2025年第8期191-200,共10页Surface Technology

基　　金：国家重点研发计划(2021YFB3400800)。

摘　　要：目的 研究钨酸钠、钼酸钠、HEC(羧甲基纤维素)3种单一添加剂及其复合添加剂对粗化形貌的影响,进而提升电解铜箔粗化效果。方法 在酸性硫酸盐体系中,采用直流电沉积的方法对6μm极薄铜箔进行表面粗化处理。利用扫描电子显微镜、激光共聚焦显微镜、万能试验机表征测试手段,分别研究了单一添加剂钼酸钠、钨酸钠和HEC及其组合添加剂对极薄电解铜箔粗化表面形貌和性能的影响,并采用正交实验和极差法分析了各添加剂对粗化效果的影响程度。结果 钼酸钠和HEC均使铜箔表面晶粒出现明显细化,而钨酸钠会使铜箔的抗剥离强度明显提高,但没有明显的晶粒细化作用;复合添加剂(钼酸钠-钨酸钠-HEC)作用后,铜箔的微观形貌、粗糙度以及抗剥离强度都得到明显改善。当钼酸钠、钨酸钠和HEC的添加量分别为40、30、8 mg/L时具有最佳粗化效果,粗糙度Rz仅为1.24μm,具有0.94 N/mm的抗剥离强度。结论 钼酸钠-钨酸钠-HEC复合添加剂可以显著优化极薄铜箔的粗化效果,改善剥离强度和表面粗糙度,细化晶粒,对粗化效果的影响重要程度依次为钼酸钠>钨酸钠>HEC。The work aims to systematically improve the roughening performance of electrolytic copper foil with a composite additive of sodium molybdate,sodium tungstate,and hydroxyethyl cellulose(HEC).Electrolytic copper foil is widely used in electronic devices,especially printed circuit boards(PCBs),with key performance requirements including high peel strength and low surface roughness.In order to optimize these properties,direct current electroplating was used in a copper sulfate electroplating system and various characterization techniques were employed such as scanning electron microscopy(SEM),laser confocal microscopy(LCM),and peel strength testing.The microstructure of the rough copper foil was analyzed in detail,and the impact of various additives on the roughening effect was analyzed through orthogonal experiments and range analysis.The addition of sodium molybdate and HEC alone significantly refined the grain structure of the copper foil surface,improving its smoothness and uniformity.In contrast,sodium tungstate mainly improved the peel strength and had a relatively small impact on grain refinement.The composite additive showed significant synergistic effects,effectively optimizing the microstructure of copper foil under different concentration combinations.Specifically,the concentrations of 40 mg/L sodium molybdate,30 mg/L sodium tungstate,and 8 mg/L HEC produced the best roughening results,with the lowest surface roughness(Rz=1.24µm)and relatively high peel strength(0.94 N/mm).LCM measurements indicated that optimized composite additives significantly reduced surface roughness,helping to minimize signal transmission losses and improve the overall performance and reliability of PCBs.In addition,the importance of the three additives on Q was in the following order:sodium molybdate>sodium tungstate>HEC,and the Q value reached its maximum value(0.76)under optimal conditions.Through a comprehensive analysis of the additive mechanism,the optimal composite additive formulation was identified,significantly improving

关 键 词：电解铜箔 添加剂 表面粗化 抗剥离强度 粗糙度 

分 类 号：TQ153.1[化学工程—电化学工业]