钽酸锂晶圆减薄用超细金刚石陶瓷砂轮的制备与表征  

Preparation and Characterization of Ultrafine Diamond Ceramic Wheel for Grinding Lithium Tantalate Wafers

作　　者：刘宾 苗卫朋 杨威 丁玉龙 王志起 韩少星 穆龙阁 LIU Bin;MIAO Weipeng;YANG Wei;DING Yulong;WANG Zhiqi;HAN Shaoxing;MU Longge(Zhengzhou Research Institute for Abrasive&Grinding Co.,Ltd,Zhengzhou 450001,China)

机构地区：[1]郑州磨料磨具磨削研究所有限公司,河南郑州450001

出　　处：《超硬材料工程》2025年第2期1-6,共6页Superhard Material Engineering

基　　金：河南省重大科技专项《大尺寸硅片精密磨削加工用砂轮开发及应用》(项目编号:241100230300);国机集团重大科技专项《典型难加工材料精密切磨工具基础共性技术研究》(项目编号:ZDZX2023-4);河南省科技攻关计划项目(232102230145)。

摘　　要：为解决加工半导体晶圆钽酸锂时,由于断裂韧性低而易产生表面划痕、损伤及扩展的问题,采用空间占位法成功制备了高自锐性的超细金刚石陶瓷砂轮。此砂轮的组织结构气孔分布均匀,大、小孔径交互存在,可以有效的提升自锐性和容屑能力。试验结果表明,加工钽酸锂时,拥有大、小气孔组织结构的砂轮可以实现持续性的减薄,电流在7.8 A时,加工后的粗糙度Ra可以达到8.12 nm,且钽酸锂晶圆表面无划伤现象。文章旨在为加工钽酸锂晶圆提供一个新的思路及途径。In order to solve the problem of surface scratches,damage and expansion caused by low fracture toughness during grinding lithium tantalate wafer,the ultra-fine diamond ceramic wheel with high self-sharpening was successfully prepared by space occupy method.The pores are evenly distributed in the structure,and large and small apertures exist interactively,which can effectively improve the self-sharpness and chip capacity.The results show that when processing lithium tantalate,the grinding wheel can thin continuously.The current is about 7.8 and the roughness of lithium tantalate can reach 8.12 nm.There is no scratch on the surface of lithium tantalate wafer.These results can provide a new way to process lithium tantalate wafers.

关 键 词：钽酸锂 磨削 陶瓷结合剂 金刚石砂轮 

分 类 号：TG74[金属学及工艺—刀具与模具] TQ164[化学工程—高温制品工业]