pMDI对豆粕胶黏剂固化行为的影响  

Effect of pMDI on Curing Behavior of Soy Meal Adhesives

作　　者：叶韧 王楚楚 王春鹏[1] 储富祥[1] YE Ren;WANG Chuchu;WANG Chunpeng;CHU Fuxiang(Institute of Chemical Industry of Forest Products,CAF,Key Lab.of Biomass Energy and Material,Jiangsu Province,Key Lab.of Chemical Engineering of Forest Products,National Forestry and Grassland Administration,National Engineering Research Center of Low-Carbon Processing and Utilization of Forest Biomass,Nanjing 210042,China;Jiangsu Co-Innovation Center of Efficient Processing and Utilization of Forest Resources,Nanjing Forestry University,Nanjing 210037,China)

机构地区：[1]中国林业科学研究院林产化学工业研究所,江苏省生物质能源与材料重点实验室,国家林业和草原局林产化学工程重点实验室,林木生物质低碳高效利用国家工程研究中心,江苏南京210042 [2]南京林业大学江苏省林业资源高效加工利用协同创新中心,江苏南京210037

出　　处：《林产化学与工业》2025年第2期109-115,共7页Chemistry and Industry of Forest Products

基　　金：国家重点研发计划资助项目(2022YFD2200701)。

摘　　要：针对豆粕胶黏剂(豆胶)固化速度慢的问题,利用聚亚甲基二苯基二异氰酸酯(pMDI)作为豆粕胶黏剂的固化促进剂,探究pMDI对豆胶固化行为的影响。利用流变实验分析豆胶固化过程中的模量变化,采用Kissinger-Akahira-Sunose(KAS)法计算豆胶固化过程中的表观活化能,同时通过红外对豆胶固化前后的化学结构进行了表征,热重(TG)实验分析了pMDI的添加对豆胶热稳定性的影响。研究结果表明:豆胶在整个固化过程中储能模量随pMDI添加量增加项快速增加,从初始的200 Pa提高至10^(6) Pa。pMDI的添加可以有效降低豆胶所需的固化温度,pMDI添加量5%(SPM5)时,豆胶固化阶段的表观活化能从91.3 kJ/mol降低至45.0 kJ/mol。FT-IR和流变行为分析表明,pMDI与大豆蛋白之间发生交联反应,且反应后期,大豆蛋白与大豆多糖会发生美拉德反应,促进了豆胶的固化。热重分析可知,为获取最佳固化效果,豆胶的固化温度不宜超过160℃。To address the issue of slow curing rates in soybean meal-based adhesives,polymeric methylene diphenyl diisocyanate(pMDI)was used as a curing accelerator to investigate its effects on the curing behavior of the adhesive.Rheological experiments were conducted to analyze the changes in the modulus during the curing process,while the apparent activation energy was calculated using the Kissinger-Akahira-Sunose(KAS)method.Fourier transform infrared spectrometer(FT-IR)was employed to characterize the chemical structure of the adhesive before and after curing,and thermograoimetric(TG)was used to evaluate the effect of pMDI addition on the thermal stability of the adhesive.The results showed that the modulus of the soybean meal adhesive increased rapidly during the curing process,from an initial value of 200 Pa to 10^(6) Pa.The addition of pMDI effectively reduced the curing temperature required for the adhesive,lowering the average apparent activation energy during the curing process from 91.3 kJ/mol to 49.3 kJ/mol.FT-IR analysis indicated that pMDI participated in crosslinking reactions with soybean protein.And,in the later stages of the curing process,a Maillard reaction occurred between the soybean protein and soybean polysaccharides.TG analysis results suggested that,for optimal curing performance,the curing temperature should not exceed 160℃.Overall,the use of pMDI as a curing accelerator significantly improved the curing rate and reduced the activation energy required for the curing reaction of soybean meal-based adhesives.

关 键 词：大豆蛋白 流变 固化 动力学 

分 类 号：TQ35[化学工程]